Building of super high-efficiency processing technology based on innovative concept (Establishment of effective polishing process of SiC substrate using Dilatancy pad tool with bowl feed method)
DOI, Toshiro K., SESHIMO, Kiyoshi, YAMAZAKI, Tsutomu, OHTSUBO, Masanori, NISHIZAWA, Hideaki, MURAKAMI, Sachi, ICHIKAWA, Daizo, NAKAMURA, Yoshio, MIYASHITA, Tadakazu, KAWAMURA, Yoshihide, TAKAGI, Masataka, KASHIWADA, Hiroshi, AIDA, Hideo
Published in Kikai Gakkai ronbunshū = Transactions of the Japan Society of Mechanical Engineers (2015)
Published in Kikai Gakkai ronbunshū = Transactions of the Japan Society of Mechanical Engineers (2015)
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Journal Article
Smart Polishing of Hard-to-Machine Materials with an Innovative Dilatancy Pad under High-Pressure, High-Speed, Immersed Condition
Doi, Toshiro K., Seshimo, Kiyoshi, Yamazaki, Tsutomu, Ohtsubo, Masanori, Ichikawa, Daizo, Miyashita, Tadakazu, Takagi, Masataka, Saeki, Taku, Aida, Hideo
Published in ECS journal of solid state science and technology (01.01.2016)
Published in ECS journal of solid state science and technology (01.01.2016)
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Journal Article
POLISHING APPARATUS
OHTSUBO MASANORI, MIYASHITA TADAKAZU, SESHIMO KIYOSHI, ICHIKAWA DAIZO
Year of Publication 11.01.2017
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Year of Publication 11.01.2017
Patent
Proposal and development of a novel high-speed/high-pressure polishing machine aiming at the super high efficiency process of the hard-to-process substrates
Yamazaki, Tsutomu, Doi, Toshiro K., Ichikawa, Daizo, Seshimo, Kiyoshi, Miyashita, Tadakazu, Ohtsubo, Masanori
Published in Proceedings of International Conference on Planarization/CMP Technology 2014 (01.11.2014)
Published in Proceedings of International Conference on Planarization/CMP Technology 2014 (01.11.2014)
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Conference Proceeding
Development of innovative "dilatancy pad" realizing super high efficiency and high-grade polishing of SiC wide band Gap semiconductor substrates
Doi, Toshiro K., Seshimo, Kiyoshi, Takagi, Masataka, Ohtsubo, Masanori, Yamazaki, Tsutomu, Nishizawa, Hideaki, Aida, Hideo, Murakami, Sachi
Published in Proceedings of International Conference on Planarization/CMP Technology 2014 (01.11.2014)
Published in Proceedings of International Conference on Planarization/CMP Technology 2014 (01.11.2014)
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Conference Proceeding
Polishing apparatus
KIYOSHI SESHIMO, TADAKAZU MIYASHITA, DAIZO ICHIKAWA, MASANORI OHTSUBO
Year of Publication 11.01.2017
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Year of Publication 11.01.2017
Patent