by Triyoso, Dina H., Hempel, K., Ohsiek, S., Jaschke, V., Shu, J., Mutas, S., Dittmar, K., Schaeffer, J., Utess, D., Lenski, M.
Published in ECS journal of solid state science and technology (01.01.2013)

by Gerlich, Lukas, Ohsiek, Susanne, Klein, Christoph, Geiß, Mario, Friedemann, Michael, Kücher, Peter, Schmeißer, Dieter
Published in Microelectronic engineering (01.06.2013)

by Triyoso, D. H., Hempel, K., Ohsiek, S., Shu, J., Schaeffer, J. K., Lenski, M.
Published in Proceedings of 2013 International Conference on IC Design & Technology (ICICDT) (01.05.2013)

by Triyoso, D. H., Weinreich, W., Seidell, K., Nolan, M. G., Polakowski, P., Utess, D., Ohsiek, S., Dittmar, K., Weisheit, M., Licbau, M., Fox, R.
Published in 2014 IEEE International Conference on IC Design & Technology (01.05.2014)

by Kelwing, Torben, Mutas, Sergej, Trentzsch, Martin, Naumann, Andreas, Trui, Bernhard, Herrmann, Lutz, Graetsch, Falk, Klein, Christoph, Wilde, Lutz, Ohsiek, Susanne, Weisheit, Martin, Peeva, Anita, Richter, Inka, Prinz, Hartmut, Wuerfel, Alexander, Carter, Rick, Stephan, Rolf, Kücher, Peter, Hansch, Walter
Published in ECS transactions (01.10.2010)

by Gerlich, L., Ohsiek, S., Klein, C., Geiss, M., Friedemann, M., Kucher, P., Schmeisser, D.
Published in 2011 IEEE International Interconnect Technology Conference (01.05.2011)

by Wojcik, H., Friedemann, M., Feustel, F., Albert, M., Ohsiek, S., Metzger, J., Voss, J., Bartha, J.W., Wenzel, C.
Published in 2007 IEEE International Interconnect Technology Conferencee (01.06.2007)

by GERDING AUSTIN R, ORAM SAMUEL J, OHSIEK RICK, PALAZZOLO JOSEPH, ARDEN TONY, ENGERER DANIEL
Year of Publication 23.12.2015