Oxovanadium(IV) Silsesquioxane Complexes
Ohde, Christian, Limberg, Christian, Stösser, Reinhard, Demeshko, Serhiy
Published in Inorganic chemistry (01.03.2010)
Published in Inorganic chemistry (01.03.2010)
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Journal Article
V2O5/SiO2 surface inspired, silsesquioxane-derived oxovanadium complexes and their properties
Ohde, Christian, Brandt, Marcus, Limberg, Christian, Döbler, Jens, Ziemer, Burckhard, Sauer, Joachim
Published in Dalton transactions : an international journal of inorganic chemistry (21.01.2008)
Published in Dalton transactions : an international journal of inorganic chemistry (21.01.2008)
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Journal Article
Progress in the Compilation of an Oxovanada-Silsesquioxane Portfolio and Catalytic Activity of Organometallic Representatives in Ethylene Polymerisation
Ohde, Christian, Limberg, Christian, Schmidt, Dennis, Enders, Markus, Demeshko, Serhiy, Knispel, Christina
Published in ZAAC - Journal of Inorganic and General Chemistry (01.11.2010)
Published in ZAAC - Journal of Inorganic and General Chemistry (01.11.2010)
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Book Review
Journal Article
V 2 O 5 /SiO 2 surface inspired, silsesquioxane-derived oxovanadium complexes and their properties
Ohde, Christian, Brandt, Marcus, Limberg, Christian, Döbler, Jens, Ziemer, Burckhard, Sauer, Joachim
Published in Dalton transactions : an international journal of inorganic chemistry (2008)
Published in Dalton transactions : an international journal of inorganic chemistry (2008)
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Journal Article
COPPER PLATING BATH COMPOSITION
BRUNNER HEIKO, ROHDE DIRK, ROELFS BERND, FERRO ANGELO, KOHLMANN LARS, SCHMOEKEL ANDRE, MANN OLIVIER, BANGERTER TIMO, KIRBS ANDREAS, ACKERMANN STEFANIE, WITCZAK AGNIESZKA, OHDE CHRISTIAN
Year of Publication 31.07.2015
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Year of Publication 31.07.2015
Patent
Next Generation Plating Technologies for FO-Panel Level Packaging
Zoberbier, Ralph, Welsh, James, Ohde, Christian, Huebner, Henning
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
Filling of Microvias and Through Holes by Electrolytic Copper Plating - Current Status and Future Outlook
Ozkok, Mustafa, Lamprecht, Sven, Ozkok, Akif, Chien, Simon, Hubner, Henning, Ohde, Christian
Published in 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2018)
Published in 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2018)
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Conference Proceeding