Numerical Analysis of Aerodynamic Characteristics of Hyperloop System
Oh, Jae-Sung, Kang, Taehak, Ham, Seokgyun, Lee, Kwan-Sup, Jang, Yong-Jun, Ryou, Hong-Sun, Ryu, Jaiyoung
Published in Energies (Basel) (06.02.2019)
Published in Energies (Basel) (06.02.2019)
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Journal Article
Inductive Design Exploration Method with Active Learning for Complex Design Problems
Jang, Sungwoo, Choi, Hae-Jin, Choi, Seung-Kyum, Oh, Jae-Sung
Published in Applied sciences (01.12.2018)
Published in Applied sciences (01.12.2018)
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Journal Article
High temperature oxidation behavior of Ni-Cr-Al based powder porous metal
Oh, Jae-Sung, Shim, Min-Chul, Park, Man-Ho, Lee, Kee-Ahn
Published in Metals and materials international (01.09.2014)
Published in Metals and materials international (01.09.2014)
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Journal Article
High Temperature Oxidation of Ni-Fe-Cr-Al Porous Metal
Choi, Sung-Hwan, Oh, Jae-Sung, Yun, Jung-Yeul, Kong, Young-Min, Kim, Byoung-Kee, Lee, Kee-Ahn
Published in Advanced engineering materials (01.03.2013)
Published in Advanced engineering materials (01.03.2013)
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Journal Article
Enhancing Efficiency in Bidirectional Resonant DC-DC Converter
Kim, Eun-Soo, Oh, Jae-Sung, Kim, Min-Ji, Lee, Jun-Hwan, Woo, Jung-Won, Jeon, Yong-Seog
Published in 2020 IEEE Applied Power Electronics Conference and Exposition (APEC) (01.03.2020)
Published in 2020 IEEE Applied Power Electronics Conference and Exposition (APEC) (01.03.2020)
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Conference Proceeding
중년여성의 운동수행실태와 운동수행에 영향을 미치는 요인
오성재, Sung Jae Oh, 김증임, Jeung Im Kim, 채영란, Young Ran Chae
Published in Korean journal of women health nursing (20.12.2010)
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Published in Korean journal of women health nursing (20.12.2010)
Journal Article
The effects of solder deformation on the wetting characteristics and interfacial reaction of Sn–3.5Ag solders on Cu substrates in fluxless soldering
Lee, Jeong Hwan, Ma, Sung Woo, Kim, Young Min, Lee, Jin Su, Kim, Ki Bum, Kim, Jae Myun, Oh, Jae Sung, Kim, Namseog, Kim, Young-Ho
Published in Journal of materials science. Materials in electronics (01.09.2013)
Published in Journal of materials science. Materials in electronics (01.09.2013)
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Journal Article
Reliability studies on micro-bumps for 3-D TSV integration
Ho-Young Son, Sung-Kwon Noh, Hyun-Hee Jung, Woong-Sun Lee, Jae-Sung Oh, Nam-Seog Kim
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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Conference Proceeding
Characterization of plasticity and stresses in TSV structures in stacked dies using synchrotron x-ray microdiffraction
Tengfei Jiang, Chenglin Wu, Peng Su, Xi Liu, Chia, Pierre, Li Li, Ho-Young Son, Jae-Sung Oh, Kwang-Yoo Byun, Nam-Seog Kim, Im, Jay, Rui Huang, Ho, Paul S.
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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Conference Proceeding
Current density effects on the electrical reliability of ultra fine-pitch micro-bump for TSV integration
Young-Bae Park, Seung-Hyun Kim, Jong-Jin Park, Kim, June-Bum, Ho-Young Son, Kwon-Whan Han, Jae-Sung Oh, Nam-Seog Kim, Sehoon Yoo
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
Published in 2013 IEEE 63rd Electronic Components and Technology Conference (01.05.2013)
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Conference Proceeding
Reliability challenges of through-silicon-via (TSV) stacked memory chips for 3-D integration: From transistors to packages
Ho-Young Son, Woong-Sun Lee, Seung-Kwon Noh, Min-Suk Suh, Jae-Sung Oh, Nam-Seog Kim
Published in 2013 IEEE International Interconnect Technology Conference - IITC (01.06.2013)
Published in 2013 IEEE International Interconnect Technology Conference - IITC (01.06.2013)
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Conference Proceeding
High Temperature Oxidation Behaviors of Fe-Cr-Al Based Powder Porous Metal and a Strip
Lim, Seon-Hui, Oh, Jae-Sung, Kong, Young-Min, Kim, Byung-Kee, Park, Man-Ho, Lee, Kee-Ahn
Published in Korean Journal of Metals and Materials (05.10.2013)
Published in Korean Journal of Metals and Materials (05.10.2013)
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Journal Article