Robust Image Processing Software for Void Calculation in Thermal Interface Materials
Song, Mei-Hui, Oh, Zi-Ying, Lee, Xi-Wen, Ng, Marcus, Zee, Bernice, Foo, Fang-Jie, Jiang, Ting-Ying
Published in 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (24.07.2023)
Published in 2023 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (24.07.2023)
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Conference Proceeding
Sports-Related Sudden Cardiac Deaths in Singapore - An Eleven-Year Review
Oh, Ying Zi, Lee, Chin Thye, Lim, Ang Tee, Tong, Khim Leng
Published in Annals of the Academy of Medicine, Singapore (01.05.2019)
Published in Annals of the Academy of Medicine, Singapore (01.05.2019)
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Journal Article
Validation of Hospital Frailty Risk Score in Heart Failure
Teo, Zhenwei, Oh, Ying Zi, Huang, Weiliang, Lee, Sheldon, Chang, Ting Yu, Lim, Aileen, Sim, Lydia Euphemia, Espelata, Wrenzie Del Valle, Conroy, Simon, Rosario, Barbara H
Published in Journal of Asian Pacific Society of Cardiology (20.05.2024)
Published in Journal of Asian Pacific Society of Cardiology (20.05.2024)
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Journal Article
Fundamental study of fracture strength of silicon dies in flip-chip lidless packages
Sathanantham, R. S., Fang Jie Foo, Zi Ying Oh
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
Published in 2012 IEEE 14th Electronics Packaging Technology Conference (EPTC) (01.12.2012)
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Conference Proceeding
Recent advances in fault isolation for semiconductor industry
Jiann Min Chin, Narang, Vinod, Meng Yeow Tay, Shei Lay Phoa, Venkat, Ravikumar, Lwin Hnin Ei, Soon Huat Lim, Chea Wei Teo, Zulkifli, Syahirah, Wen Qiu, Tan, Joseph, Ranganathan, Gopi, Zi Ying Oh, Fang Jie Foo
Published in Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2013)
Published in Proceedings of the 20th IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2013)
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Conference Proceeding