Search Results - "Ofner, Gerald" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

PACKAGE-ON-PACKAGE STACKED MICROELECTRONIC STRUCTURES

PACKAGE-ON-PACKAGE STACKED MICROELECTRONIC STRUCTURES

by MEYER THORSTEN, OFNER GERALD
Year of Publication 27.04.2016

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Patent

MICROELECTROMECHANICAL SYSTEM (MEMS) ON APPLICATION SPECIFIC INTEGRATED CIRCUIT (ASIC)

MICROELECTROMECHANICAL SYSTEM (MEMS) ON APPLICATION SPECIFIC INTEGRATED CIRCUIT (ASIC)

by MEYER THORSTEN, OFNER GERALD
Year of Publication 23.03.2015

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Patent

INTEGRATED CIRCUIT PACKAGE

INTEGRATED CIRCUIT PACKAGE

by MEYER THORSTEN, OFNER GERALD, ZUDOCK FRANK, GEISSLER CHRISTIAN, OSSIANDER TEODORA
Year of Publication 21.09.2015

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Patent

MICROELECTRONIC PACKAGE HAVING A PASSIVE MICROELECTRONIC DEVICE DISPOSED WITHIN A PACKAGE BODY

MICROELECTRONIC PACKAGE HAVING A PASSIVE MICROELECTRONIC DEVICE DISPOSED WITHIN A PACKAGE BODY

by MEYER THORSTEN, WOLTER ANDREAS, SEIDEMANN GEORG, ALBERS SVEN, OFNER GERALD, GEISSLER CHRISTIAN
Year of Publication 19.09.2016

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Patent

CHIP ARRANGEMENT AND METHOD FOR MANUFACTURING A CHIP ARRANGEMENT

CHIP ARRANGEMENT AND METHOD FOR MANUFACTURING A CHIP ARRANGEMENT

by AUGUSTIN ANDREAS, MEYER THORSTEN, MUELLER CHRISTIAN, OFNER GERALD, GEISSLER CHRISTIAN, MAHNKOPF REINHARD
Year of Publication 15.12.2014

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Patent

PACKAGE-ON-PACKAGE STACKED MICROELECTRONIC STRUCTURES

PACKAGE-ON-PACKAGE STACKED MICROELECTRONIC STRUCTURES

by OFNER, Gerald, MEYER, Thorsten
Year of Publication 16.10.2020

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Patent

Package-on-package stacked microelectronic structures

Package-on-package stacked microelectronic structures

by Meyer, Thorsten, Ofner, Gerald
Year of Publication 19.02.2019

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Patent

MOLDED POWER SEMICONDUCTOR PACKAGE WITH GATE CONNECTOR FEATURE

MOLDED POWER SEMICONDUCTOR PACKAGE WITH GATE CONNECTOR FEATURE

by Nikitin, Ivan, Guth, Karsten, Ofner, Gerald, Neugirg, Christian
Year of Publication 21.12.2023

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Patent

PACKAGE-ON-PACKAGE STACKED MICROELECTRONIC STRUCTURES

PACKAGE-ON-PACKAGE STACKED MICROELECTRONIC STRUCTURES

by OFNER, Gerald, MEYER, Thorsten
Year of Publication 18.10.2017

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Patent

Integrated circuit packages

Integrated circuit packages

by Ganesan, Sanka, Meyer, Thorsten, Ofner, Gerald
Year of Publication 26.01.2021

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Patent

PACKAGE-ON-PACKAGE STACKED MICROELECTRONIC STRUCTURES

PACKAGE-ON-PACKAGE STACKED MICROELECTRONIC STRUCTURES

by OFNER, Gerald, MEYER, Thorsten
Year of Publication 17.05.2017

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Patent

PACKAGE-ON-PACKAGE STACKED MICROELECTRONIC STRUCTURES

PACKAGE-ON-PACKAGE STACKED MICROELECTRONIC STRUCTURES

by OFNER, GERALD, MEYER, THORSTEN
Year of Publication 27.01.2017

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Patent

PACKAGE-ON-PACKAGE STACKED MICROELECTRONIC STRUCTURES

PACKAGE-ON-PACKAGE STACKED MICROELECTRONIC STRUCTURES

by Meyer Thorsten, Ofner Gerald
Year of Publication 08.09.2016

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Patent

INTEGRATED CIRCUIT PACKAGES

INTEGRATED CIRCUIT PACKAGES

by Ganesan, Sanka, Meyer, Thorsten, Ofner, Gerald
Year of Publication 28.11.2019

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Patent

Flat lead package formation method

Flat lead package formation method

by Miethaner, Stefan, Scherl, Peter, Heinrich, Alexander, Theuss, Horst, Bradl, Stephan, Meyer, Thorsten, Ofner, Gerald
Year of Publication 16.05.2023

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Patent

Chip interposer, semiconductor device, and method for manufacturing a semiconductor device

Chip interposer, semiconductor device, and method for manufacturing a semiconductor device

by MEYER THORSTEN, OFNER GERALD
Year of Publication 16.02.2016

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Patent

PACKAGE-ON-PACKAGE STACKED MICROELECTRONIC STRUCTURES

PACKAGE-ON-PACKAGE STACKED MICROELECTRONIC STRUCTURES

by OFNER, GERALD, MEYER, THORSTEN
Year of Publication 14.01.2016

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Patent

MICROELECTRONIC PACKAGE HAVING A PASSIVE MICROELECTRONIC DEVICE DISPOSED WITHIN A PACKAGE BODY AND ITS MANUFACTURING METHOD

MICROELECTRONIC PACKAGE HAVING A PASSIVE MICROELECTRONIC DEVICE DISPOSED WITHIN A PACKAGE BODY AND ITS MANUFACTURING METHOD

by GEISSLER, Christian, SEIDEMANN, Georg, WOLTER, Andreas, OFNER, Gerald, MEYER, Thorsten, ALBERS, Sven
Year of Publication 11.05.2022

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Patent

Package with vertical interconnect between carrier and clip

Package with vertical interconnect between carrier and clip

by Heinrich, Alexander, Goller, Bernd, Meyer, Thorsten, Ofner, Gerald
Year of Publication 07.07.2020

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Patent

Multi-purpose non-linear semiconductor package assembly line

Multi-purpose non-linear semiconductor package assembly line

by Miethaner, Stefan, Scherl, Peter, Heinrich, Alexander, Theuss, Horst, Bradl, Stephan, Meyer, Thorsten, Ofner, Gerald
Year of Publication 12.04.2022

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