Second use or recycling of hydrogen waste gas from the semiconductor industry - Economic analysis and technical demonstration of possible pathways
Rochlitz, L., Steinberger, M., Oechsner, R., Weber, A., Schmitz, S., Schillinger, K., Wolff, M., Bayler, A.
Published in International journal of hydrogen energy (21.06.2019)
Published in International journal of hydrogen energy (21.06.2019)
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Journal Article
Tunnel field-effect transistors with graphene channels
Svintsov, D. A., Vyurkov, V. V., Lukichev, V. F., Orlikovsky, A. A., Burenkov, A., Oechsner, R.
Published in Semiconductors (Woodbury, N.Y.) (01.02.2013)
Published in Semiconductors (Woodbury, N.Y.) (01.02.2013)
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Journal Article
Yield model for estimation of yield impact of semiconductor manufacturing equipment
Nutsch, A, Oechsner, R, Schoepka, U, Pfitzner, L
Published in 2010 International Symposium on Semiconductor Manufacturing (ISSM) (01.10.2010)
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Published in 2010 International Symposium on Semiconductor Manufacturing (ISSM) (01.10.2010)
Conference Proceeding
Approach for a Standardized Methodology for Multisite Processing of 300-mm Wafers at R&D Sites
Oechsner, R., Pfeffer, M., Frickinger, J., Schellenberger, M., Roeder, G., Pfitzner, L., Ryssel, H., Fritzsche, M., Kaushik, V., Renaud, D., Danel, A., Claeys, C., Bearda, T., Lering, M., Graef, M., Murphy, B., Walther, H., Hury, S.
Published in IEEE transactions on semiconductor manufacturing (01.08.2007)
Published in IEEE transactions on semiconductor manufacturing (01.08.2007)
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Journal Article
Conference Proceeding
Properties of TaN Thin Films Produced Using PVD Linear Dynamic Deposition Technique
Kozlowska, M., Oechsner, R., Pfeffer, M., Bauer, A. J., Meissner, E., Pfitzner, L., Ryssel, H., Maass, W., Langer, J., Ocker, B., Schmidbauer, S., Gonchond, J.-P.
Published in E-journal of surface science and nanotechnology (01.01.2009)
Published in E-journal of surface science and nanotechnology (01.01.2009)
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Journal Article
Predictive sampling approach to dynamically optimize defect density control operations
Pfeffer, M., Oechsner, R., Pfitzner, L., Eckert, S., Hartmann, A., Gold, H., Biebl, G., Kaspar, J.
Published in 2012 SEMI Advanced Semiconductor Manufacturing Conference (01.05.2012)
Published in 2012 SEMI Advanced Semiconductor Manufacturing Conference (01.05.2012)
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Conference Proceeding
Trends in European R&D - Advanced Process Control Down to Atomic Scale for Micro- and Nanotechnologies
Pfitzner, Lothar, Schellenberger, M., Oechsner, R., Roeder, G., Pfeffer, M.
Published in ECS transactions (28.04.2006)
Published in ECS transactions (28.04.2006)
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Journal Article
Integrated process control for cluster tools using an in-line analytical module
Kasko, I., Oechsner, R., Schneider, C., Pfitzner, L., Ryssel, H., Foreschle, B.
Published in 1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023) (1997)
Published in 1997 IEEE International Symposium on Semiconductor Manufacturing Conference Proceedings (Cat. No.97CH36023) (1997)
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Conference Proceeding
Approach for a Standardized Methodology for Multisite Processing of 300-mm Wafers at R & D Sites
Oechsner, R, Pfeffer, M, Frickinger, J, Schellenberger, M, Roeder, G, Pfitzner, L, Ryssel, H, Fritzsche, M, Kaushik, V, Renaud, D, Danel, A, Claeys, C, Bearda, T, Lering, M, Graef, M, Murphy, B, Walther, H, Hury, S
Published in IEEE transactions on semiconductor manufacturing (01.08.2007)
Published in IEEE transactions on semiconductor manufacturing (01.08.2007)
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Journal Article
Adhesion and proliferation of keratinocytes on ion beam modified polyethylene
Svorcík, V, Walachová, K, Prosková, K, Dvoránková, B, Vogtová, D, Ochsner, R, Ryssel, H
Published in Journal of materials science. Materials in medicine (01.10.2000)
Published in Journal of materials science. Materials in medicine (01.10.2000)
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Journal Article
Approach for a Standardized Methodology for Multi-Site Processing of 300mm Wafers at R&D-Sites
Oechsner, R., Frickinger, J., Pfeffer, M., Schellenberger, M., Roeder, G., Pfitzner, L., Ryssel, H., Fritzsche, M., Kaushik, V., Renaud, D., Danel, A., Claeys, C., Bearda, T., Lering, M., Graef, M., Murphy, B., Walther, H., Hury, S.
Published in 2006 IEEE International Symposium on Semiconductor Manufacturing (01.09.2006)
Published in 2006 IEEE International Symposium on Semiconductor Manufacturing (01.09.2006)
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Conference Proceeding
Novel process control strategies for 300 mm semiconductor production
Pfitzner, Lothar, Oechsner, Richard, Schneider, Claus, Ryssel, Heiner, Riemer, Manfred, von Podewils, Mario
Published in Microelectronic engineering (01.07.1999)
Published in Microelectronic engineering (01.07.1999)
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Journal Article
FLYING WAFER - A STANDARDISED METHODOLOGY FOR MULTI-SITE PROCESSING OF 300 MM WAFERS AT R&D-SITES
Frickinger, J., Oechsner, R., Schellenberger, M., Pfeffer, M., Pfitzner, L., Ryssel, H., Claeys, C., Claes, M., Bearda, T., Renaud, D., Danel, A., Lering, M., Graef, M., Kaushik, V., Murphy, B., Fritzsche, M., Walther, H., Hury, S.
Published in IFAC Proceedings Volumes (2006)
Published in IFAC Proceedings Volumes (2006)
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Journal Article