by Maydanik, Y.F., Vershinin, S.V., Korukov, M.A., Ochterbeck, J.M.
Published in IEEE transactions on components and packaging technologies (01.06.2005)

by Grujicic, M., Zhao, C.L., Chittajallu, K.M., Ochterbeck, J.M.
Published in Materials science & engineering. B, Solid-state materials for advanced technology (15.05.2004)

by Grujicic, M, Sellappan, V, Arakere, G, Ochterbeck, J.M, Seyr, Norbert, Obieglo, Andreas, Erdmann, Marc, Holzleitner, Jochen
Published in Multidiscipline modeling in materials and structures (01.01.2010)

by Chai, L.H., Peng a, X.F., Wang, B.X., Ochterbeck, J.M.
Published in International journal of heat and mass transfer (01.11.1998)

by Wang, Z., Peng, X.F., Ochterbeck, J.M.
Published in International journal of heat and mass transfer (01.10.2004)

by Grujicic, M., Sellappan, V., Arakere, G., Ochterbeck, J.M., Seyr, Norbert, Obieglo, Andreas, Erdmann, Marc, Holzleitner, Jochen
Published in Multidiscipline modeling in materials and structures (16.06.2010)

by Delhaye, J.M., Maugin, F., Ochterbeck, J.M.
Published in International journal of heat and mass transfer (01.09.2004)

by Rankins, K.B., Ainsworth, S.D., Sullivan, T.M., Ochterbeck, J.M., LaBerge, M.
Published in Proceedings of the 17th Southern Biomedical Engineering Conference (1998)

by Ainsworth, S.D., Childs, D., Langan, E.M., Taylor, S.M., Ochterbeck, J.M., LaBerge, M.
Published in Proceedings of the 17th Southern Biomedical Engineering Conference (1998)

by Maydanik, Y.F., Vershinin, S.V., Korukov, M.A., Ochterbeck, J.M.
Published in The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) (2004)

by Riehl, R.R., Seleghim, P., Ochterbeck, J.M.
Published in ITherm'98. Sixth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.98CH36208) (1998)