In-Situ EDS Characterization of TEM Lamellae Created by Xe Plasma FIB
Hrnčíř, Tomáš, Lang, Christian, Vincenc Oboňa, Jozef, Barták, Tomáš
Published in Microscopy and microanalysis (01.08.2015)
Published in Microscopy and microanalysis (01.08.2015)
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Journal Article
Xe plasma FIB Delayering of IC based on 14 nm node technology
Oboňa, Jozef Vincenc, Hrnčíř, Tomáš, Sharang, Šikula, Marek, Denisyuk, Andrey
Published in Microscopy and microanalysis (01.07.2016)
Published in Microscopy and microanalysis (01.07.2016)
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Journal Article
Curtaining-Free Top-Down TEM Lamella Preparation from a Cutting Edge Integrated Circuit
Denisyuk, Andrey, Hrnčíř, Tomáš, Oboňa, Jozef Vincenc, Petrenec, Martin, Jan Michalička
Published in Microscopy and microanalysis (01.07.2016)
Published in Microscopy and microanalysis (01.07.2016)
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Journal Article
Xe Plasma vs Gallium FIB Delayering
Sharang, S., Anzalone, Paul, Obona, Jozef Vincenc
Published in Microscopy and microanalysis (01.08.2019)
Published in Microscopy and microanalysis (01.08.2019)
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Journal Article
Speeding up large-scale failure analysis of semiconductor devices by laser ablation
Tucek, Marek, Blando, Rodrigo, Vana, Rostislav, Hladik, Lukas, Obona, Jozef Vincenc
Published in 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (20.07.2020)
Published in 2020 IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA) (20.07.2020)
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Conference Proceeding
Nanotubes Made from Deeply Undercooled Cryolite/Alumina Melts
Korenko, Michal, Kucharík, Marián, Oboňa, Jozef Vincenc, Janičkovič, Dušan, Córdoba, Rosa, De Teresa, José María, Kubíková, Blanka
Published in Helvetica chimica acta (01.07.2008)
Published in Helvetica chimica acta (01.07.2008)
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Journal Article
In-depth Analysis of 10 nm Exynos Processor using Micro CT and FIB-SEM System
Sharang, S, Dluhos, Jiri, Kalasova, Dominika, Denisyuk, Andrey, Vana, Rostislav, Zikmund, Tomas, Kaiser, Jozef, Obona, Jozef Vincenc
Published in 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2019)
Published in 2019 IEEE 26th International Symposium on Physical and Failure Analysis of Integrated Circuits (IPFA) (01.07.2019)
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Conference Proceeding
Xe Plasma vs. Gallium FIB Delayering
Sharang, Sharang, Anzalone, Paul, Obona, Jozef Vincenc
Published in Electronic device failure analysis (01.08.2019)
Published in Electronic device failure analysis (01.08.2019)
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Magazine Article