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Year of Publication 28.05.2014
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Wafer level packaging to lidded chips
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Year of Publication 21.02.2013
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Recessed optical surfaces
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Year of Publication 05.10.2011
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Year of Publication 05.10.2011
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Wafer level chip packaging
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Year of Publication 11.08.2011
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Recessed optical surfaces
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Year of Publication 16.09.2010
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Wafer level chip packaging
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Year of Publication 16.10.2007
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Year of Publication 16.10.2007
Patent
Wafer level packaging to lidded chips
GRINMAN, ANDREY, HECHT, ILYA, HUMPSTON, GILES, BURTZLAFF, ROBERT, ROSENSTEIN, CHARLES, OGANESIAN, VAGE, HAZANOVICH, FELIX, OVRUTSKY, DAVID, AKSENTON, YULIA, AVSIAN, OSHER, DAYAN, AVI, NYSTROM, MICHAEL J
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Year of Publication 01.10.2007
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