Tin Whisker Test Development-Temperature and Humidity Effects Part I: Experimental Design, Observations, and Data Collection
Reynolds, H.L., Osenbach, J.W., Henshall, G., Parker, R.D., Peng Su
Published in IEEE transactions on electronics packaging manufacturing (01.01.2010)
Published in IEEE transactions on electronics packaging manufacturing (01.01.2010)
Get full text
Journal Article
Sn whiskers: material, design, processing, and post-plate reflow effects and development of an overall phenomenological theory
Osenbach, J.W., Shook, R.L., Vaccaro, B.T., Potteiger, B.D., Amin, A.N., Hooghan, K.N., Suratkar, P., Ruengsinsub, P.
Published in IEEE transactions on electronics packaging manufacturing (01.01.2005)
Published in IEEE transactions on electronics packaging manufacturing (01.01.2005)
Get full text
Journal Article
Conference Proceeding
INHIBITION OF COPPER DISSOLUTION FOR LEAD-FREE SOLDERING
DELUCCA JOHN M, OSENBACH JOHN W, AMIN AHMED, XIONG ZHENGPENG, BACHMAN MARK ADAM, BAIOCCHI FRANK A
Year of Publication 02.04.2010
Get full text
Year of Publication 02.04.2010
Patent