Development of Copper Via Exposure by two steps process
Chiew, Joe Ong Siong, Sheng, Vincent Lee Wen, Gao Shan
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
Published in 2011 IEEE 13th Electronics Packaging Technology Conference (01.12.2011)
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Conference Proceeding
Method of Forming a Bonded Structure
ONG SIONG CHIEW JOE, CHOI WON KYOUNG, XIE LING, BAI KEWU, PREMACHANDRAN CHIRAHARIKATHU VEEDU SANKARAPILLAI, LIAO EBIN
Year of Publication 14.02.2013
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Year of Publication 14.02.2013
Patent
METHOD OF STACKING CHIPS
KHAN, ORATTI, KALANDAR, NAVAS, HO, SOON WEE, SELVANAGAM, CHERYL, SHARMANI, ONG, SIONG CHIEW, JOE
Year of Publication 01.09.2011
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Year of Publication 01.09.2011
Patent
A METHOD OF FORMING A BONDED STRUCTURE
PREMACHANDRAN, CHIRAHARIKATHU VEEDU SANKARAPILLAI, XIE, LING, BAI, KEWU, ONG, SIONG CHIEW JOE, CHOI, WON KYOUNG, LIAO, EBIN
Year of Publication 27.09.2012
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Year of Publication 27.09.2012
Patent
A METHOD OF FORMING A BONDED STRUCTURE
PREMACHANDRAN, CHIRAHARIKATHU VEEDU SANKARAPILLAI, XIE, LING, BAI, KEWU, ONG, SIONG CHIEW JOE, CHOI, WON KYOUNG, LIAO, EBIN
Year of Publication 18.08.2011
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Year of Publication 18.08.2011
Patent