Optimization of fins used in electronic packaging
Eu Ong, Kang, Oon Lee, Kor, Seetharamu, K.N, Azid, I.A, Quadir, G.A, Zainal, Z.A, Joo Goh, Teck
Published in Microelectronics international (01.04.2005)
Published in Microelectronics international (01.04.2005)
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Journal Article
Predictive Modelling Methodologies for Bi-material Strip Warpage
Wang, Jenn An, Eu, Ong. Kang, Weng, Wen Hsin, Hsu, Chih Chung, Loh, Wei Keat, Kulterman, Ron W., Fu, Haley
Published in 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (21.10.2020)
Published in 2020 15th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (21.10.2020)
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Conference Proceeding
Study of Dynamic Warpage of Flip Chip Packages under Temperature Reflow
Chee Kan Lee, Wei Keat Loh, Kang Eu Ong, Chin, I.
Published in 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium (01.11.2006)
Published in 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium (01.11.2006)
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Conference Proceeding
Solder Joint Reliability Performance of Flip Chip Molded Ball Grid Array (BGA) Package for Network/Communication Application
Ong Kang Eu, Too Seong Ling, Loh Wei Keat, Peralta, C., Ong LayLing, Chan Choi Keng, Yap Eng Hooi
Published in 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium (01.11.2006)
Published in 2006 Thirty-First IEEE/CPMT International Electronics Manufacturing Technology Symposium (01.11.2006)
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Conference Proceeding
Advancement in modeling vapor pressure induced stresses in electronic packaging
Loh Wei Keat, Lee Yung Hsiang, Ong Kang Eu, Chin Ian, Leong Jenn Seong
Published in 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) (01.04.2015)
Published in 2015 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) (01.04.2015)
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Conference Proceeding
Thermal analysis of embedded chip
Lee Pik San, Ong Kang Eu, Azid, I. A.
Published in 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2012)
Published in 2012 35th IEEE/CPMT International Electronics Manufacturing Technology Conference (IEMT) (01.11.2012)
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Conference Proceeding
FLIP CHIP ASSEMBLY PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON PACKAGE ASSEMBLY
LIM SIH FEI, LOKE MUN LEONG, ONG KANG EU, MONG WENG KHOON, LIM BOK SIM, ONG TEAN WEE, RUDGE A VETHANAYAGAM
Year of Publication 18.11.2010
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Year of Publication 18.11.2010
Patent
The correlation of package coplanarity and reflow warpage to SMT
Lee Yung Hsiang, Ong Kang Eu, Loh Wei Keat, Wong Shaw Fong, Gill, Paramjeet S, Tan Kah Kee
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
Published in 2010 34th IEEE/CPMT International Electronic Manufacturing Technology Symposium (IEMT) (01.11.2010)
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Conference Proceeding
Solder Joint Reliability (SJR) Study of Integrated Heat Spreader (IHS) Packages
Shaw Fong Wong, Wei Keat Loh, Kang Eu Ong, Yung Hsiang Lee, Huey Ling Lew, Seok Ling Lee
Published in 2006 International Conference on Electronic Materials and Packaging (01.12.2006)
Published in 2006 International Conference on Electronic Materials and Packaging (01.12.2006)
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Conference Proceeding
Predictive Modelling Methodologies for Bi-Material Wafer Warpage
Ong, Kang Eu, Loh, Wei Keat, Wang, Jenn An, Purushotaman, Arvind, Yoshida, Tatsuro, Murayama, Kei, Tsukahara, Makoto, Kulterman, Ron W., Fu, Haley
Published in 2021 International Conference on Electronics Packaging (ICEP) (12.05.2021)
Published in 2021 International Conference on Electronics Packaging (ICEP) (12.05.2021)
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Conference Proceeding
Molded Electronic Package Warpage Predictive Modelling Methodologies
Ong, Kang Eu, Loh, Wei Keat, Kulterman, Ron W., Hsu, Chih Chung, Wang, Jenn An, Fu, Haley
Published in 2019 International Conference on Electronics Packaging (ICEP) (01.04.2019)
Published in 2019 International Conference on Electronics Packaging (ICEP) (01.04.2019)
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Conference Proceeding
STIFFENER FOR A PACKAGE SUBSTRATE
Kong, Jackson Chung Peng, Lim, Seok Ling, Ong, Jenny Shio Yin, Ong, Kang Eu, Chea, Bok Eng
Year of Publication 03.01.2019
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Year of Publication 03.01.2019
Patent
CHIP CARRIER HAVING VARIABLY-SIZED PADS
WEI CHUNG Lee, LAM Chun Mun, LOKE Mun Leong, WONG Chee Ling, ONG Kang Eu
Year of Publication 15.06.2017
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Year of Publication 15.06.2017
Patent
Flip chip assembly process for ultra thin substrate and package on package assembly
LIM SIH FEI, LOKE MUN LEONG, ONG KANG EU, RUDGE A. VETHANAYAGAM, MONG WENG KHOON, LIM BOK SIM, ONG TEAN WEE
Year of Publication 19.07.2016
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Year of Publication 19.07.2016
Patent
FLIP CHIP ASSEMBLY PROCESS FOR ULTRA THIN SUBSTRATE AND PACKAGE ON PACKAGE ASSEMBLY
LIM SIH FEI, LOKE MUN LEONG, ONG KANG EU, RUDGE A. VETHANAYAGAM, MONG WENG KHOON, LIM BOK SIM, ONG TEAN WEE
Year of Publication 19.03.2015
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Year of Publication 19.03.2015
Patent