Study of power integrity challenges in high-speed I/O design using power rails merging scheme
Li Wern Chew, Paik Wen Ong
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
Published in 2013 IEEE 15th Electronics Packaging Technology Conference (EPTC 2013) (01.12.2013)
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Conference Proceeding
Dual Referencing Simulation Approach on High Speed Interconnects USB3.2 (10Gbps)
Chew, Li Wern, Wen Ong, Paik
Published in 2022 International Conference on Electronics Packaging (ICEP) (11.05.2022)
Published in 2022 International Conference on Electronics Packaging (ICEP) (11.05.2022)
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Conference Proceeding
SIPI Co-Sim: Signal Performance of Super Speed Differential I/O with Power Referencing Design
Chew, Li Wern, Ong, Paik Wen
Published in 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) (01.12.2018)
Published in 2018 IEEE 20th Electronics Packaging Technology Conference (EPTC) (01.12.2018)
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Conference Proceeding
EMBEDDED VOLTAGE REFERENCE PLANE FOR SYSTEM-IN-PACKAGE APPLICATIONS
CHEAH, Bok Eng, OOI, Ping Ping, ONG, Paik Wen, KONG, Jackson Chung Peng, OOI, Kooi Chi
Year of Publication 24.06.2023
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Year of Publication 24.06.2023
Patent
VOLTAGE NOISE REDUCTION OF POWER DELIVERY NETWORKS FOR INTEGRATED CIRCUITS
Jl, Yun, CHEN, Herh Nan, CAI, Xingjian, HUANG, Jimmy Huat Since, ONG, Paik Wen
Year of Publication 25.07.2022
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Year of Publication 25.07.2022
Patent
SEMICONDUCTOR PACKAGE WITH RING-IN-RING STIFFENERS AND METHODS OF ASSEMBLING SAME
CHEAH, Bok Eng, ONG, Paik Wen, KONG, Jackson Chung Peng, OOI, Kooi Chi
Year of Publication 09.03.2022
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Year of Publication 09.03.2022
Patent
Voltage noise reduction of power delivery networks for integrated circuits
Ong, Paik Wen, Ji, Yun, Chen, Herh Nan, Cai, Xingjian, Huang, Jimmy Huat Since
Year of Publication 06.04.2021
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Year of Publication 06.04.2021
Patent
Ring-in-ring configurable-capacitance stiffeners and methods of assembling same
Ong, Paik Wen, Kong, Jackson Chung Peng, Cheah, Bok Eng, Ooi, Kooi Chi
Year of Publication 16.03.2021
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Year of Publication 16.03.2021
Patent
Ring-in-ring configurable-capacitance stiffeners and methods of assembling same
Ong, Paik Wen, Kong, Jackson Chung Peng, Cheah, Bok Eng, Ooi, Kooi Chi
Year of Publication 12.05.2020
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Year of Publication 12.05.2020
Patent
VOLTAGE NOISE REDUCTION OF POWER DELIVERY NETWORKS FOR INTEGRATED CIRCUITS
CHEN, Herh Nan, CAI, Xingjian, HUANG, Jimmy Huat Since, ONG, Paik Wen, JI, Yun
Year of Publication 24.10.2019
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Year of Publication 24.10.2019
Patent
RING-IN-RING CONFIGURABLE-CAPACITANCE STIFFENERS AND METHODS OF ASSEMBLING SAME
Ong, Paik Wen, Kong, Jackson Chung Peng, Cheah, Bok Eng, Ooi, Kooi Chi
Year of Publication 22.08.2019
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Year of Publication 22.08.2019
Patent
RING-IN-RING CONFIGURABLE-CAPACITANCE STIFFENERS AND METHODS OF ASSEMBLING SAME
Ong, Paik Wen, Kong, Jackson Chung Peng, Cheah, Bok Eng, Ooi, Kooi Chi
Year of Publication 04.04.2019
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Year of Publication 04.04.2019
Patent
RING-IN-RING CONFIGURABLE-CAPACITANCE STIFFENERS AND METHODS OF ASSEMBLING SAME
CHEAH, Bok Eng, ONG, Paik Wen, KONG, Jackson Chung Peng, OOI, Kooi Chi
Year of Publication 03.04.2019
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Year of Publication 03.04.2019
Patent
EMBEDDED VOLTAGE REFERENCE PLANE FOR SYSTEM-IN-PACKAGE APPLICATIONS
Ong, Paik Wen, Kong, Jackson Chung Peng, Cheah, Bok Eng, Ooi, Kooi Chi, Ooi, Ping Ping
Year of Publication 09.08.2018
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Year of Publication 09.08.2018
Patent
VOLTAGE NOISE REDUCTION OF POWER DELIVERY NETWORKS FOR INTEGRATED CIRCUITS
CHEN, Herh Nan, CAI, Xingjian, HUANG, Jimmy Huat Since, ONG, Paik Wen, JI, Yun
Year of Publication 05.07.2018
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Year of Publication 05.07.2018
Patent