Search Results - "OLSON; LEONARD T" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

REPAIRABLE MULTI-LEVEL SYSTEM FOR SEMICONDUCTOR DEVICE

REPAIRABLE MULTI-LEVEL SYSTEM FOR SEMICONDUCTOR DEVICE

by OLSON, LEONARD T, ECKER, MARIO E
Year of Publication 17.01.1990

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Patent

De-coupled printed circuits

De-coupled printed circuits

by ECKER; MARIO E, OLSON; LEONARD T
Year of Publication 15.11.1988

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Patent

REPAIRABLE MULTI-LEVEL SYSTEM FOR SEMICONDUCTOR DEVICE

REPAIRABLE MULTI-LEVEL SYSTEM FOR SEMICONDUCTOR DEVICE

by OLSON, LEONARD T, ECKER, MARIO E
Year of Publication 17.09.1986

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Patent

Repairable multi-level overlay system for semiconductor device

Repairable multi-level overlay system for semiconductor device

by ECKER; MARIO E, OLSON; LEONARD T
Year of Publication 22.10.1985

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Patent

Repairable multi-level system for semiconductor device

Repairable multi-level system for semiconductor device

by OLSON, LEONARD T, ECKER, MARIO E
Year of Publication 25.01.1984

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Patent

High density interconnection means for chip carriers

High density interconnection means for chip carriers

by ECKER; MARIO E, OLSON; LEONARD T
Year of Publication 22.03.1983

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Patent

Integrated circuit package

Integrated circuit package

by ECKER; MARIO E, OLSON; LEONARD T
Year of Publication 17.02.1981

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Patent

HIGH SPEED OPTICAL INTERCONNECT

HIGH SPEED OPTICAL INTERCONNECT

by KACHMARIK; RICHARD, AUSTIN; FRANCIS D, OLSON; LEONARD T
Year of Publication 06.04.1993

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Patent

High speed optical interconnect

High speed optical interconnect

by KACHMARIK, RICHARD, AUSTIN, FRANCIS D, OLSON, LEONARD T
Year of Publication 10.02.1993

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Patent

COMPOSITE DIELECTRIC STRUCTURE FOR OPTIMIZING ELECTRICAL PERFORMANCE IN HIGH PERFORMANCE CHIP SUPPORT PACKAGES

COMPOSITE DIELECTRIC STRUCTURE FOR OPTIMIZING ELECTRICAL PERFORMANCE IN HIGH PERFORMANCE CHIP SUPPORT PACKAGES

by PAGNANI, DAVID P, OLSON, LEONARD T, CHARSKY, RONALD S
Year of Publication 13.08.1991

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Patent

Composite dielectric structure for optimizing electrical performance in high performance chip support packages

Composite dielectric structure for optimizing electrical performance in high performance chip support packages

by PAGNANI; DAVID P, OLSON; LEONARD T, CHARSKY; RONALD S
Year of Publication 10.04.1990

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Patent

Flexible film chip carrier with decoupling capacitors

Flexible film chip carrier with decoupling capacitors

by BLACK; VINCENT J, OLSON; LEONARD T, CHARSKY; RONALD S
Year of Publication 10.05.1988

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Patent

ELECTRONIC PACKAGE WITH DISTRIBUTED DECOUPLING CAPACITORS

ELECTRONIC PACKAGE WITH DISTRIBUTED DECOUPLING CAPACITORS

by BROWN, MICHAEL B, EBERT, WILLIAM S, OLSON, LEONARD T, SLOMA, RICHARD R
Year of Publication 19.11.1992

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Patent

Electronic package with integrated distributed decoupling capacitors

Electronic package with integrated distributed decoupling capacitors

by BROWN; MICHAEL B, EBERT; WILLIAM S, OLSON; LEONARD T, SLOMA; RICHARD R
Year of Publication 31.07.1990

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Patent

ELECTRONIC PACKAGE WITH DISTRIBUTED DECOUPLING CAPACITORS

ELECTRONIC PACKAGE WITH DISTRIBUTED DECOUPLING CAPACITORS

by BROWN, MICHAEL B, EBERT, WILLIAM S, OLSON, LEONARD T, SLOMA, RICHARD R
Year of Publication 09.11.1988

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Patent

Electronic package with distributed decoupling capacitors

Electronic package with distributed decoupling capacitors

by BROWN, MICHAEL B, EBERT, WILLIAM S, OLSON, LEONARD T, SLOMA, RICHARD R
Year of Publication 06.04.1988

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Patent

OPTOELECTRONIC ASSEMBLY

OPTOELECTRONIC ASSEMBLY

by NOLAN, RICHARD G, ARVANITAKIS, NICOLAOS C, OLSON, LEONARD T., JR, BLACK, VINCENT J, CORLEY, RICHARD E., JR
Year of Publication 29.06.1993

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Patent

OPTOELECTRONIC ASSEMBLY

OPTOELECTRONIC ASSEMBLY

by NOLAN, RICHARD G, ARVANITAKIS, NICOLAOS C, OLSON, LEONARD T., JR, BLACK, VINCENT J, CORLEY, RICHARD E., JR
Year of Publication 29.06.1993

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Patent

Multilevel integrated circuit packaging structures

Multilevel integrated circuit packaging structures

by LEDERMANN; PETER G, MIERSCH; EKKEHARD F, BREGMAN; MARK F, TSOU; UH-PO E, REILEY; TIMOTHY C, PAGNANI; DAVID P, BICKFORD; HARRY R, GOW, III; JOHN, VILKELIS; WALTER V, OLSON; LEONARD T, CIPOLLA; THOMAS M
Year of Publication 02.07.1991

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Patent

ELEKTRONISCHE PACKUNG MIT VERTEILTEN ENTKOPPLUNGSKONDENSATOREN

ELEKTRONISCHE PACKUNG MIT VERTEILTEN ENTKOPPLUNGSKONDENSATOREN

by EBERT, WILLIAM S., ENDICOTT, NY 13760, US, BROWN, MICHAEL B., BINGHAMTON NEW YORK 13903, US, OLSON, LEONARD T., ENDWELL, NY 13760, US, SLOMA, RICHARD R., ENDICOTT, NY 13760, US
Year of Publication 09.06.1993

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Patent