Single-Layer Release Material Having Laser Lift-Off and Chip Fixing Property for FO-WLP Chip First Process
Okuno, Takahisa, Shinjo, Tetsuya, Usui, Yuki, Fukuda, Takuya, Yanai, Masaki, Yagyu, Masafumi
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
Published in 2023 IEEE 73rd Electronic Components and Technology Conference (ECTC) (01.05.2023)
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Conference Proceeding
LAMINATE, METHOD FOR MANUFCTURING LAMINATE, AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE
OGATA, Hiroto, OKUNO, Takahisa, SHINJO, Tetsuya, FUKUDA, Takuya, MORIYA, Shunsuke
Year of Publication 23.10.2024
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Year of Publication 23.10.2024
Patent