7.1 A 1/4-inch 8Mpixel CMOS image sensor with 3D backside-illuminated 1.12μm pixel with front-side deep-trench isolation and vertical transfer gate
JungChak Ahn, Kyungho Lee, Yitae Kim, Heegeun Jeong, Bumsuk Kim, Hongki Kim, Jongeun Park, Taesub Jung, Wonje Park, Taeheon Lee, Eunkyung Park, Sangjun Choi, Gyehun Choi, Haeyong Park, Yujung Choi, Seungwook Lee, Yunkyung Kim, Jung, Y. Jay, Donghyuk Park, Seungjoo Nah, Youngsun Oh, Mihye Kim, Yooseung Lee, Youngwoo Chung, Hisanori, Ihara, Joonhyuk Im, Lee, Daniel K. J., Byunghyun Yim, GiDoo Lee, Heesang Kown, Sungho Choi, Jeonsook Lee, Dongyoung Jang, Youngchan Kim, Tae Chan Kim, Hiroshige, Goto, Chi-Young Choi, Duckhyung Lee, GabSoo Han
Published in 2014 IEEE International Solid-State Circuits Conference Digest of Technical Papers (ISSCC) (01.02.2014)
Published in 2014 IEEE International Solid-State Circuits Conference Digest of Technical Papers (ISSCC) (01.02.2014)
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Conference Proceeding
A 2.8 μm Pixel for Time of Flight CMOS Image Sensor with 20 ke-Full-Well Capacity in a Tap and 36 % Quantum Efficiency at 940 nm Wavelength
Kwon, Yonghun, Seo, Sungyoung, Cho, Sunghyuck, Choi, Sung-Ho, Hwang, Taeun, Kim, Youngchan, Jin, Young-Gu, Oh, Youngsun, Keel, Min-Sun, Kim, Daeyun, Bae, Myunghan, Km, Yeomyung, Shin, Seung-Chul, Hong, Sunju, Lee, Seok-Ha, Park, Ho Woo, Kim, Yitae, Koh, Kyoungmin, Ahn, JungChak
Published in 2020 IEEE International Electron Devices Meeting (IEDM) (12.12.2020)
Published in 2020 IEEE International Electron Devices Meeting (IEDM) (12.12.2020)
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Conference Proceeding
IMAGE SENSOR AND METHOD OF OPERATING THE SAME
OH, Youngsun, SHIN, Jongyoon, CHOI, Hana, JEON, Honghyun, KIM, Munhwan
Year of Publication 08.02.2024
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Year of Publication 08.02.2024
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