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Year of Publication 13.07.2023
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Year of Publication 29.06.2023
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Year of Publication 09.05.2024
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SENSOR SHIFT ACTUATOR AND CAMERA MODULE INCLUDING THE SAME
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Year of Publication 11.08.2023
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Year of Publication 11.08.2023
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SENSOR SHIFT ACTUATOR AND CAMERA MODULE INCLUDING THE SAME
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Year of Publication 14.07.2023
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Year of Publication 14.07.2023
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Camera module and optical image stabilizer
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Year of Publication 30.06.2023
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Printed circuit board
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Year of Publication 11.05.2023
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Camera module and optical image stabilizer
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Year of Publication 02.05.2023
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Year of Publication 02.05.2023
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Touch panel and fabricating method thereof
YIM JUNG RYOUL, CHAE KYOUNG SOO, OH NAM KEUN, HONG YUN KI, PARK JANG HO
Year of Publication 06.10.2015
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Year of Publication 06.10.2015
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Method of manufacturing printed circuit board having bump
CHOI JONG-GYU, KIM YOUNG-JI, KIM SANG-DUCK, PARK JUNG-HYUN, KIM JI-EUN, OH NAM-KEUN
Year of Publication 24.03.2015
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Year of Publication 24.03.2015
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Method of manufacturing a ball grid array substrate or a semiconductor chip package
KIM YOUNG JI, CHOI JONG GYU, PARK JUNG HYUN, KIM SANG DUCK, KANG MYUNG SAM, OH NAM KEUN, KIM JI EUN
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Year of Publication 03.02.2015
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TOUCH PANEL AND METHOD FOR MANUFACTURING THE SAME
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Year of Publication 03.07.2014
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TOUCH PANEL AND FABRICATING METHOD THEREOF
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Year of Publication 26.06.2014
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METHOD OF MANUFACTURING A BALL GRID ARRAY SUBSTRATE OR A SEMICONDUCTOR CHIP PACKAGE
KIM YOUNG JI, CHOI JONG GYU, PARK JUNG HYUN, KIM SANG DUCK, KANG MYUNG SAM, OH NAM KEUN, KIM JI EUN
Year of Publication 16.01.2014
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Year of Publication 16.01.2014
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Ball grid array substrate with insulating layer and semiconductor chip package
KIM YOUNG JI, CHOI JONG GYU, PARK JUNG HYUN, KIM SANG DUCK, KANG MYUNG SAM, OH NAM KEUN, KIM JI EUN
Year of Publication 01.10.2013
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Year of Publication 01.10.2013
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