The New Roles of Substrates in the Packaging Technologies for Systems
Oggioni, Stefano Sergio
Published in 2024 IEEE 24th International Conference on Nanotechnology (NANO) (08.07.2024)
Published in 2024 IEEE 24th International Conference on Nanotechnology (NANO) (08.07.2024)
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Conference Proceeding
Optical Transceiver Module for 1.2 Tb/s Based on Flexible Circuit Technology
Weiss, Jonas, Jubin, Daniel, Meier, Norbert, Offrein, Bert Jan, Oggioni, Stefano, Rietveld, Willy, Duis, Jeroen, Spoor, Cor, Smink, Rutger, Dorrestein, Sander, Herb, Bill, Bowen, Terry, Cormany, Dave
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.08.2017)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.08.2017)
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Journal Article
IC SUBSTRATE WITH SUPPORT STRUCTURE AND FUNCTIONAL INLAYS THEREIN
GAVAGNIN, Marco, WEIS, Gerald, OGGIONI, Stefano Sergio, LEITGEB, Markus
Year of Publication 16.11.2023
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Year of Publication 16.11.2023
Patent
IC SUBSTRATE WITH SUPPORT STRUCTURE AND FUNCTIONAL INLAYS THEREIN
Leitgeb, Markus, Weis, Gerald, Gavagnin, Marco, Oggioni, Stefano Sergio
Year of Publication 15.11.2023
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Year of Publication 15.11.2023
Patent
The evolution of build-up package technology and its design challenges
Blackshear, E. D., Cases, M., Klink, E., Engle, S. R., Malfatt, R. S., de Araujo, D. N., Oggioni, S., LaCroix, L. D., Wakil, J. A., Pham, N. H., Hougham, G. G., Russell, D. J.
Published in IBM journal of research and development (01.07.2005)
Published in IBM journal of research and development (01.07.2005)
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Journal Article