A three-scale approach to the numerical simulation of metallic bonding for MEMS packaging
Ghisi, Aldo, Mariani, Stefano, Corigliano, Alberto, Allegato, Giorgio, Oggioni, Laura
Published in Microelectronics and reliability (01.09.2014)
Published in Microelectronics and reliability (01.09.2014)
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Journal Article
Conference Proceeding
High vacuum wafer level packaging for uncooled infrared sensor
Urquia, Mikel Azpeitia, Allegato, Giorgio, Paleari, Stefano, Tripodi, Francesco, Oggioni, Laura, Garavaglia, Matteo, Nemirovsky, Yael, Blank, Tanya
Published in 2020 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) (01.06.2020)
Published in 2020 Symposium on Design, Test, Integration & Packaging of MEMS and MOEMS (DTIP) (01.06.2020)
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Conference Proceeding
Andromeda: A Flexible MEMS Technology Platform for a Variety of Piezoelectrically Actuacted Micromirrors
Martini, Irene, Alessandri, Anna, Carminati, Marta, Carminati, Roberto, Ferrarini, Paolo, Gatti, Daniela A. L., Gianola, Riccardo, Lazarova, Borka, Lazzari, Carla M., Nomellini, Andrea, Oggioni, Laura, Pedrini, Claudia, Prelini, Carlo L., Tacchini, Riccardo, Vimercati, Michele
Published in 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS) (15.01.2023)
Published in 2023 IEEE 36th International Conference on Micro Electro Mechanical Systems (MEMS) (15.01.2023)
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Conference Proceeding
MEMS device formed by at least two bonded structural layers and manufacturing process thereof
Somaschini, Roberto, Garavaglia, Matteo, Allegato, Giorgio, Oggioni, Laura
Year of Publication 23.03.2021
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Year of Publication 23.03.2021
Patent
MEMS DEVICE FORMED BY AT LEAST TWO BONDED STRUCTURAL LAYERS AND MANUFACTURING PROCESS THEREOF
SOMASCHINI, Roberto, ALLEGATO, Giorgio, GARAVAGLIA, Matteo, OGGIONI, Laura
Year of Publication 23.04.2020
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Year of Publication 23.04.2020
Patent
MEMS device formed by at least two bonded structural layers and manufacturing process thereof
Somaschini, Roberto, Garavaglia, Matteo, Allegato, Giorgio, Oggioni, Laura
Year of Publication 25.02.2020
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Year of Publication 25.02.2020
Patent