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Year of Publication 15.04.2022
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Year of Publication 15.04.2022
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KIM SOUNGSOO, OEZKOEK AKIF, KLOBUS MARCIN, MIRKOVIC MARKO, BRUEGGMANN HORST, BERTHOLD HERWIG JOSEF, SCHIWON THOMAS, REENTS BERT
Year of Publication 15.04.2022
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Year of Publication 15.04.2022
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A Novel Horizontal Copper Pattern Plating System with High Throughput
Ozkok, Mustafa, Schatz, Andreas, Ozkok, Akif, Hubner, Henning, Chien, Simon
Published in 2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2019)
Published in 2019 14th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2019)
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Conference Proceeding
Filling of Microvias and Through Holes by Electrolytic Copper Plating - Current Status and Future Outlook
Ozkok, Mustafa, Lamprecht, Sven, Ozkok, Akif, Chien, Simon, Hubner, Henning, Ohde, Christian
Published in 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2018)
Published in 2018 13th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) (01.10.2018)
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Conference Proceeding
mistura de compostos oligomÉricos de fenazÍnio, mÉtodo de preparaÇço dessa mistura, banho de Ácido para deposiÇço eletrolÍtica de uma camada de cobre e mÉtodo para deposiÇço eletrolÍtica de uma camada de cobre
HEIKO BRUNNER, AKIF OEZKOEK, THOMAS MORITZ, WOLFGANG DAHMS, UDO GRIESER
Year of Publication 05.02.2013
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Year of Publication 05.02.2013
Patent
MIXTURE OF OLIGOMERIC PHENAZINIUM COMPOUNDS AND ACID BATH FOR ELECTROLYTICALLY DEPOSITING A COPPER DEPOSIT
DAHMS, WOLFGANG, BRUNNER, HEIKO, GRIESER, UDO, MORITZ, THOMAS, OEZKOEK, AKIF
Year of Publication 18.10.2011
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Year of Publication 18.10.2011
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Mixture of oligomeric phenazinium compounds and acid bath for electrolytically depositing a copper deposit
GRIESER UDO, BRUNNER HEIKO, OEZKOEK AKIF, DAHMS WOLFGANG, MORITZ THOMAS
Year of Publication 18.01.2011
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Year of Publication 18.01.2011
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MIXTURE OF OLIGOMERIC PHENAZINIUM COMPOUNDS AND ACID BATH FOR ELECTROLYTICALLY DEPOSITING A COPPER DEPOSIT
DAHMS, WOLFGANG, BRUNNER, HEIKO, GRIESER, UDO, MORITZ, THOMAS, OEZKOEK, AKIF
Year of Publication 25.03.2009
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Year of Publication 25.03.2009
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MIXTURE OF OLIGOMERIC PHENAZINIUM COMPOUNDS AND ACID BATH FOR ELECTROLYTICALLY DEPOSITING A COPPER DEPOSIT
DAHMS, WOLFGANG, BRUNNER, HEIKO, GRIESER, UDO, MORITZ, THOMAS, OEZKOEK, AKIF
Year of Publication 09.11.2005
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Year of Publication 09.11.2005
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MIXTURE OF OLIGOMERIC PHENAZINIUM COMPOUNDS AND ACID BATH FOR ELECTROLYTICALLY DEPOSITING A COPPER DEPOSIT
GRIESER UDO, BRUNNER HEIKO, OEZKOEK AKIF, DAHMS WOLFGANG, MORITZ THOMAS
Year of Publication 29.08.2005
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Year of Publication 29.08.2005
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PROCESS FOR FILLING µ-BLIND VIAS
HERKO GENTH, KAI-JENS MATEJAT, OSWALD IGEL, AKIF OEZKOEK, BERND OTTMAR ROELFS
Year of Publication 31.12.2007
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Year of Publication 31.12.2007
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MIXTURE OF OLIGOMERIC PHENAZINIUM COMPOUNDS AND ACID BATH FOR ELECTROLYTICALLY DEPOSITING A COPPER DEPOSIT
DAHMS, WOLFGANG, BRUNNER, HEIKO, GRIESER, UDO, MORITZ, THOMAS, OEZKOEK, AKIF
Year of Publication 08.07.2004
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Year of Publication 08.07.2004
Patent
MIXTURE OF OLIGOMERIC PHENAZINIUM COMPOUNDS AND ACID BATH FOR ELECTROLYTICALLY DEPOSITING A COPPER DEPOSIT
DAHMS, WOLFGANG, BRUNNER, HEIKO, GRIESER, UDO, MORITZ, THOMAS, OEZKOEK, AKIF
Year of Publication 08.07.2004
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Year of Publication 08.07.2004
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Mixture of di-, tri- and other oligomeric phenazinium compounds, used in copper electroplating bath for decorative plating or plating circuit board or semiconductor substrate, is prepared from monomer by diazotization and boiling
DAHMS, WOLFGANG, BRUNNER, HEIKO, GRIESER, UDO, MORITZ, THOMAS, OEZKOEK, AKIF
Year of Publication 03.06.2004
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Year of Publication 03.06.2004
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Mixture of oligomeric phenazinium compounds and acid bath for electrolytically depositing a copper deposit
GRIESER UDO, OEZKOEK AKIF, BRUNNER HEIKO, DAHMS WOLFGANG, MORITZ THOMAS
Year of Publication 09.05.2012
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Year of Publication 09.05.2012
Patent