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"ODEGARD CHARLES A"
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"ODEGARD CHARLES A"
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System and Method to Increase Die Stand-off Height
by
ODEGARD CHARLES A
Year of Publication
21.09.2006
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MANUFACTURING SYSTEM AND APPARATUS FOR BALANCED PRODUCT FLOW WITH APPLICATION TO LOW-STRESS UNDERFILING OF FLIP-CHIP ELECTRONIC DEVICES
by
YAMUNAN, VINU
,
ODEGARD
,
CHARLES
,
A
,
CHI, TZNG
Year of Publication
27.01.2010
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System and method for polymer encapsulated solder lid attach
by
ODEGARD CHARLES A
,
CHIU TZNG
Year of Publication
30.11.2006
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Increased stand-off height integrated circuit assemblies, systems, and methods
by
ODEGARD CHARLES A
,
CHIU TZNG
Year of Publication
19.10.2006
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Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devices
by
ODEGARD CHARLES A
,
YAMUNAN VINU
,
CHIU TZNG
Year of Publication
29.01.2008
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Vibration-Assisted Method for Underfilling Flip-Chip Electronic Devices
by
ODEGARD CHARLES A
,
SUBIDO WILLMAR E
Year of Publication
03.01.2008
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Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devices
by
ODEGARD CHARLES A
.,YAMUNAN VINU,CHI TZNG
Year of Publication
13.12.2006
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MANUFACTURING SYSTEM AND APPARATUS FOR BALANCED PRODUCT FLOW WITH APPLICATION TO LOW-STRESS UNDERFILING OF FLIP-CHIP ELECTRONIC DEVICES
by
YAMUNAN, VINU
,
ODEGARD
,
CHARLES
,
A
,
CHI, TZNG
Year of Publication
06.09.2006
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METHOD OF FORMING A PROBE PAD LAYOUT/DESIGN, AND RELATED DEVICE
by
MIRANDA ARIEL L
,
ODEGARD CHARLES A
,
KAWAKAMI NORIHIRO
Year of Publication
30.07.2009
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METHODS AND APPARATUS TO SUPPORT AN OVERHANGING REGION OF A STACKED DIE
by
COWENS, MARVIN, W
,
ODEGARD
,
CHARLES
,
A
,
ARNOLD, RICHARD, W
Year of Publication
26.03.2009
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Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devices
by
ODEGARD CHARLES A
,
YAMUNAN VINU
,
CHIU TZNG
Year of Publication
09.02.2006
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METHODS AND APPARATUS TO SUPPORT AN OVERHANGING REGION OF A STACKED DIE
by
COWENS, MARVIN, W
,
ODEGARD
,
CHARLES
,
A
,
ARNOLD, RICHARD, W
Year of Publication
12.02.2009
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METHODS AND APPARATUS TO SUPPORT AN OVERHANGING REGION OF A STACKED DIE
by
ODEGARD CHARLES A
,
ARNOLD RICHARD W
,
COWENS MARVIN W
Year of Publication
12.02.2009
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Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devices
by
ODEGARD CHARLES A
,
YAMUNAN VINU
,
CHIU TZNG
Year of Publication
20.12.2005
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Vibration-assisted method for underfilling flip-chip electronic devices
by
ODEGARD CHARLES A
,
SUBIDO WILLMAR E
Year of Publication
17.11.2005
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MANUFACTURING SYSTEM AND APPARATUS FOR BALANCED PRODUCT FLOW WITH APPLICATION TO LOW-STRESS UNDERFILING OF FLIP-CHIP ELECTRONIC DEVICES
by
YAMUNAN, VINU
,
ODEGARD
,
CHARLES
,
A
,
CHI, TZNG
Year of Publication
22.09.2005
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Scalable method for identifying cracks and fractures under wired or ball bonded bond pads
by
HEUSSNER DARYL R
,
ODEGARD CHARLES A
,
OGAWA ENNIS T
Year of Publication
09.10.2008
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MANUFACTURING SYSTEM AND APPARATUS FOR BALANCED PRODUCT FLOW WITH APPLICATION TO LOW-STRESS UNDERFILING OF FLIP-CHIP ELECTRONIC DEVICES
by
YAMUNAN, VINU
,
ODEGARD
,
CHARLES
,
A
,
CHI, TZNG
Year of Publication
23.06.2005
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Manufacturing system and apparatus for balanced product flow with application to low-stress underfilling of flip-chip electronic devices
by
ODEGARD CHARLES A
,
YAMUNAN VINU
,
CHIU TZNG
Year of Publication
09.06.2005
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Vibration-assisted method for underfilling flip-chip electronic devices
by
Odegard
,
Charles A
,
Subido, Willmar E
Year of Publication
15.02.2005
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