Search Results - "OBINATA MASAYOSHI" :: K.UTB vyhledávací portál

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MANUFACTURING METHOD OF PHOTOCATALYST

by OBINATA MASAYOSHI, MURAOKA HIROKI, HIGAMI AKIHIRO
Year of Publication 24.06.2019

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METHOD OF FORMING BUMP WITHOUT JUNCTION DEFECTS

by OBINATA MASAYOSHI, MASUDA AKIHIRO
Year of Publication 11.03.2010

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Patent

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ANODE ELECTRODE ATTACHMENT STRUCTURE FOR ELECTROPLATING

by OBINATA MASAYOSHI, MASUDA AKIHIRO
Year of Publication 04.09.2008

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Patent

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GOLD-TIN ALLOY BRAZING FILLER METAL HAVING EXCELLENT WETTABILITY

by OBINATA MASAYOSHI
Year of Publication 05.06.2001

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ANODE PELLET FOR Sn-PLATING, AND METHOD OF PRODUCING THE SAME

by OBINATA MASAYOSHI, KANEKO SHUNSUKE, HASHIMOTO YORISHIGE
Year of Publication 31.05.2012

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CERAMIC TARGET WITH SENSOR

by OBINATA MASAYOSHI
Year of Publication 09.10.1995

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Patent

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Au-Sn ALLOY SOLDER PASTE HAVING REDUCED GENERATION OF VOID

by OBINATA MASAYOSHI, ISHIKAWA MASAYUKI, MISHIMA TERUSHI
Year of Publication 23.10.2008

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Patent

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Sn-Au ALLOY SOLDER PASTE HAVING REDUCED PRODUCTION OF VOID

by OBINATA MASAYOSHI, ISHIKAWA MASAYUKI, MISHIMA TERUSHI
Year of Publication 17.07.2008

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Patent

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METHOD FOR JOINING WHOLE OF JUNCTION FACE OF ELEMENT TO SUBSTRATE BY USING Au-Sn ALLOY SOLDER PASTE

by OBINATA MASAYOSHI, ISHIKAWA MASAYUKI, MISHIMA TERUSHI
Year of Publication 17.01.2008

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MANUFACTURING METHOD OF GOLD ALLOY SOLDER BALL

by OBINATA MASAYOSHI, ISHIKAWA MASAYUKI, MISHIMA TERUSHI
Year of Publication 18.10.2007

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Patent

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METHOD FOR JOINING SUBSTRATE, AND ELEMENT USING AU-SN ALLOY SOLDER PASTE

by OBINATA MASAYOSHI, ISHIKAWA MASAYUKI, MISHIMA TERUSHI
Year of Publication 11.10.2007

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Patent

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METHOD FOR JOINING SUBSTRATE, AND ELEMENT USING AU-SN ALLOY SOLDER PASTE

by OBINATA MASAYOSHI, ISHIKAWA MASAYUKI, MISHIMA TERUSHI
Year of Publication 11.10.2007

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Patent

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SOLDERING METHOD USING GOLD TIN ALLOY SOLDER PASTE

by OBINATA MASAYOSHI, ISHIKAWA MASAYUKI, OGAWA REIKO
Year of Publication 06.09.2007

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Patent

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FLUX FOR SOLDER, SOLDER PASTE USING THE FLUX AND METHOD FOR PRODUCING SUBSTRATE MOUNTED WITH ELECTRONIC PARTS

by OBINATA MASAYOSHI, ISHIKAWA MASAYUKI, OGAWA REIKO
Year of Publication 30.08.2007

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AU-SN ALLOY BUMP WITHOUT INCORPORATING LARGE VOID AND METHOD FOR MANUFACTURING THE SAME

by OBINATA MASAYOSHI, ISHIKAWA MASAYUKI, MISHIMA TERUSHI
Year of Publication 07.06.2007

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METHOD OF JOINING SUBSTRATE AND ELEMENT USING Au-Sn ALLOY SOLDER PASTE

by OBINATA MASAYOSHI, ISHIKAWA MASAYUKI, MISHIMA TERUSHI
Year of Publication 15.03.2007

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Patent

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METHOD OF BONDING SUBSTRATE TO ELEMENT USING Au-Sn ALLOY SOLDER PASTE

by OBINATA MASAYOSHI, ISHIKAWA MASAYUKI, MISHIMA TERUSHI
Year of Publication 15.03.2007

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Patent

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POWDERY Pb-Sn SOLDER ALLOY FOR PASTE, AND Pb-Sn SOLDER ALLOY BALL

by OBINATA MASAYOSHI, YOSHIDA YOSHIHIRO, MASUDA AKIHIRO, ISHIKAWA MASAYUKI
Year of Publication 15.10.2009

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Patent

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FLUX FOR SOLDER, AND SOLDER PASTE USING THE FLUX

by OBINATA MASAYOSHI, ISHIKAWA MASAYUKI, OGAWA REIKO
Year of Publication 26.10.2006

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Patent

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METHOD FOR REPLENISHING Sn-ALLOY PLATING SOLUTION WITH Sn-COMPONENT AND Sn-ALLOY PLATING TREATMENT APPARATUS

by OBINATA MASAYOSHI, HISAYOSHI KANJI, MASUDA AKIHIRO, KAWAKAMI YOSHIAKI
Year of Publication 09.07.2009

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Patent

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