ELECTROLYTIC COPPER FOIL WITH CARRIER FOIL AND METHOD FOR MANUFACTURING THE SAME AND COPPER-CLAD LAMINATE USING THE ELECTROLYTIC COPPER FOIL WITH CARRIER FOIL
TOMONAGA, SAKIKO, YAMAMOTO, TAKUYA, HIGUCHI, TSUTOMU, IWAKIRI, KEN-ICHIRO, DOBASHI, MAKOTO, SUGIMOTO, AKIKO, YOSHIOKA, JUNSHI, KATAOKA, TAKASHI, OBATA, SHIN-ICHI, HIRASAWA, YUTAKA
Year of Publication 07.11.2001
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Year of Publication 07.11.2001
Patent
Method for manufacturing an electrodeposited copper foil with a high-temperature resistant carrier and an electrodeposited copper foil with a high-temperature resistant carrier obtained through the method
IWAKIRI, KEN-ICHIRO, DOBASHI, MAKOTO, SUGIMOTO, AKIKO, YOSHIOKA, JUNSHI, OBATA, SHIN-ICHI, TAKANASHI, AKITOSHI
Year of Publication 16.05.2004
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Year of Publication 16.05.2004
Patent
ELECTROLYTIC COPPER FOIL WITH CARRIER FOIL AND METHOD FOR MANUFACTURING THE SAME AND COPPER-CLAD LAMINATE USING THE ELECTROLYTIC COPPER FOIL WITH CARRIER FOIL
KEN-ICHIRO IWAKIRI, AKIKO SUGIMOTO, YUTAKA HIRASAWA, MAKOTO DOBASHI, SAKIKO TOMONAGA, TAKUYA YAMAMOTO, TSUTOMU HIGUCHI, TAKASHI KATAOKA, JUNSHI YOSHIOKA, SHIN-ICHI OBATA
Year of Publication 09.08.2002
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Year of Publication 09.08.2002
Patent