Leveler Effect and Oscillatory Behavior during Copper Electroplating
Huang, Q., Baker-O'Neal, B. C., Parks, C., Hopstaken, M., Fluegel, A., Emnet, C., Arnold, M., Mayer, D.
Published in Journal of the Electrochemical Society (01.01.2012)
Published in Journal of the Electrochemical Society (01.01.2012)
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Impact of sudden oak death on tree mortality in the Big Sur ecoregion of California
Meentemeyer, R. K., Rank, N. E., Shoemaker, D. A., Oneal, C. B., Wickland, A. C., Frangioso, K. M., Rizzo, D. M.
Published in Biological invasions (01.12.2008)
Published in Biological invasions (01.12.2008)
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Journal Article
Enhanced Grain Growth of Electroplated Copper on Cobalt-Containing Seed Layer
Huang, Q., Baker-O'Neal, B. C., Cabral, C., Simonyi, E., Deline, V. R., Hopstaken, M.
Published in Journal of the Electrochemical Society (01.01.2013)
Published in Journal of the Electrochemical Society (01.01.2013)
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Journal Article
The effect of helium plasma etching on polymer-based optoelectronic devices
Chambers, David Keith, Raut, Brijesh, Qi, Difei, O'Neal, Chad B., Selmic, Sandra Zivanovic
Published in Thin solid films (03.08.2009)
Published in Thin solid films (03.08.2009)
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Journal Article
Suppressor Effects during Copper Superfilling of Sub-100 nm Lines
Huang, Q., Baker-O’Neal, B. C., Kelly, J. J, Broekmann, P., Wirth, A., Emnet, C., Martin, M., Hahn, M., Wagner, A., Mayer, D.
Published in Electrochemical and solid-state letters (2009)
Published in Electrochemical and solid-state letters (2009)
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Journal Article
Electrodeposition of Cu on Ta-Based Layer
Kelly, J. J., Zheng, M., Deligianni, H., Baker-O’Neal, B. C., Cabral, C.
Published in Journal of the Electrochemical Society (2007)
Published in Journal of the Electrochemical Society (2007)
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Journal Article
Compliance with safe practices for preparing parenteral nutrition formulations
O'Neal, BC, Schneider, PJ, Pedersen, CA, Mirtallo, JM
Published in American journal of health-system pharmacy (01.02.2002)
Published in American journal of health-system pharmacy (01.02.2002)
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