Search Results - "Nousiainen, O." :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

Periderm prevents pathological epithelial adhesions during embryogenesis

Periderm prevents pathological epithelial adhesions during embryogenesis

by Richardson, Rebecca J, Hammond, Nigel L, Coulombe, Pierre A, Saloranta, Carola, Nousiainen, Heidi O, Salonen, Riitta, Berry, Andrew, Hanley, Neil, Headon, Denis, Karikoski, Riitta, Dixon, Michael J
Published in The Journal of clinical investigation (01.09.2014)

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Mutations in mRNA export mediator GLE1 result in a fetal motoneuron disease

Mutations in mRNA export mediator GLE1 result in a fetal motoneuron disease

by Kestilä, Marjo, Nousiainen, Heidi O, Pakkasjärvi, Niklas, Honkala, Heli, Kuure, Satu, Tallila, Jonna, Vuopala, Katri, Ignatius, Jaakko, Herva, Riitta, Peltonen, Leena
Published in Nature genetics (01.02.2008)

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Mice deficient in transmembrane prostatic acid phosphatase display increased GABAergic transmission and neurological alterations

Mice deficient in transmembrane prostatic acid phosphatase display increased GABAergic transmission and neurological alterations

by Nousiainen, Heidi O, Quintero, Ileana B, Myöhänen, Timo T, Voikar, Vootele, Mijatovic, Jelena, Segerstråle, Mikael, Herrala, Annakaisa M, Kulesskaya, Natalia, Pulkka, Anitta E, Kivinummi, Tanja, Abo-Ramadan, Usama, Taira, Tomi, Piepponen, T Petteri, Rauvala, Heikki, Vihko, Pirkko
Published in PloS one (20.05.2014)

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Reliability and RF performance of BGA solder joints with plastic-core solder balls in LTCC/PWB assemblies

Reliability and RF performance of BGA solder joints with plastic-core solder balls in LTCC/PWB assemblies

by Kangasvieri, T., Nousiainen, O., Putaala, J., Rautioaho, R., Vähäkangas, J.
Published in Microelectronics and reliability (01.08.2006)

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Enhanced thermal fatigue endurance and lifetime prediction of lead-free LGA joints in LTCC modules

Enhanced thermal fatigue endurance and lifetime prediction of lead-free LGA joints in LTCC modules

by Nousiainen, O, Salmela, O, Putaala, J, Kangasvieri, T
Published in Soldering & surface mount technology (01.01.2011)

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Thermal fatigue endurance of collapsible 95.5Sn4Ag0.5Cu spheres in LTCC/PWB assemblies

Thermal fatigue endurance of collapsible 95.5Sn4Ag0.5Cu spheres in LTCC/PWB assemblies

by Nousiainen, O., Lehtiniemi, L., Kangasvieri, T., Rautioaho, R., Vähäkangas, J.
Published in Microelectronics and reliability (01.04.2008)

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Failure mechanisms of thermomechanically loaded SnAgCu/ plastic core solder ball composite joints in low-temperature Co-fired ceramic/printed wiring board assemblies

Failure mechanisms of thermomechanically loaded SnAgCu/ plastic core solder ball composite joints in low-temperature Co-fired ceramic/printed wiring board assemblies

by NOUSIAINEN, O, PUTAALA, J, KANGASVIERI, T, RAUTIOAHO, R, VAHAKANGAS, J
Published in Journal of electronic materials (01.03.2007)

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Thermal fatigue endurance of Sn3Ag0.5Cu0.5In0.05Ni and Sn2.5Ag0.8Cu0.5Sb solders in composite solder joints of LTCC PWB assemblies

Thermal fatigue endurance of Sn3Ag0.5Cu0.5In0.05Ni and Sn2.5Ag0.8Cu0.5Sb solders in composite solder joints of LTCC PWB assemblies

by Nousiainen, O, Kangasvieri, T, Rautioaho, R, Vähäkangas, J
Published in Soldering & surface mount technology (01.01.2011)

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Bioremediation strategies for removal of residual atrazine in the boreal groundwater zone

Bioremediation strategies for removal of residual atrazine in the boreal groundwater zone

by Nousiainen, Aura O, Björklöf, Katarina, Sagarkar, Sneha, Nielsen, Jeppe Lund, Kapley, Atya, Jørgensen, Kirsten S
Published in Applied microbiology and biotechnology (01.12.2015)

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Metallurgical reactions in composite 90Pb10Sn/lead-free solder joints and their effect on reliability of LTCC/PWB assembly

Metallurgical reactions in composite 90Pb10Sn/lead-free solder joints and their effect on reliability of LTCC/PWB assembly

by NOUSIAINEN, O, PUTAALA, J, KANGASVIERI, T, RAUTIOAHO, R, VAHAKANGAS, J
Published in Journal of electronic materials (01.10.2006)

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Mutant CHUK and Severe Fetal Encasement Malformation

Mutant CHUK and Severe Fetal Encasement Malformation

by Lahtela, Jenni, Nousiainen, Heidi O, Stefanovic, Vedran, Tallila, Jonna, Viskari, Heli, Karikoski, Riitta, Gentile, Massimiliano, Saloranta, Carola, Varilo, Teppo, Salonen, Riitta, Kestilä, Marjo
Published in The New England journal of medicine (21.10.2010)

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Characterization of Sn7In4.1Ag0.5Cu solder in lead-free composite solder joints of LTCC PWB assembly

Characterization of Sn7In4.1Ag0.5Cu solder in lead-free composite solder joints of LTCC PWB assembly

by Nousiainen, O, Kangasvieri, T, Rautioaho, R, Vähäkangas, J
Published in Soldering & surface mount technology (01.01.2008)

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Effect of ENIG deposition on the failure mechanisms of thermomechanically loaded lead-free 2nd level interconnections in LTCC PWB assemblies

Effect of ENIG deposition on the failure mechanisms of thermomechanically loaded lead-free 2nd level interconnections in LTCC PWB assemblies

by Nousiainen, O, Kangasvieri, T, Kautio, K, Rautioaho, R, Vähäkangas, J
Published in Soldering & surface mount technology (01.01.2010)

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Detection of Thermal Cycling-Induced Failures in RF/Microwave BGA Assemblies

Detection of Thermal Cycling-Induced Failures in RF/Microwave BGA Assemblies

by Putaala, J., Kangasvieri, T., Nousiainen, O., Jantunen, H., Moilanen, M.
Published in IEEE transactions on electronics packaging manufacturing (01.07.2008)

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Poor Acetabular Component Orientation Increases Revision Risk in Metal-On-Metal Hip Arthroplasty

Poor Acetabular Component Orientation Increases Revision Risk in Metal-On-Metal Hip Arthroplasty

by Tauriainen, Tuomas, MS, Niinimäki, Tuukka, MD, PhD, Niinimäki, Jaakko, MD, PhD, Nousiainen, Tomi, MD, Leppilahti, Juhana, MD, PhD
Published in The Journal of arthroplasty (01.07.2017)

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Thermal fatigue in solder joints of Ag-Pd and Ag-Pt metallized LTCC modules

Thermal fatigue in solder joints of Ag-Pd and Ag-Pt metallized LTCC modules

by Rautioaho, R., Nousiainen, O., Leppävuori, S., Lenkkeri, J., Jaakola, T.
Published in Microelectronics and reliability (01.09.2001)

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Atrazine degradation in boreal nonagricultural subsoil and tropical agricultural soil

Atrazine degradation in boreal nonagricultural subsoil and tropical agricultural soil

by Nousiainen, Aura O, Björklöf, Katarina, Sagarkar, Sneha, Mukherjee, Shinjini, Purohit, Hemant J, Kapley, Atya, Jørgensen, Kirsten S
Published in Journal of soils and sediments (01.06.2014)

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Thermal fatigue and metallurgical reactions in solder joints of LTCC modules

Thermal fatigue and metallurgical reactions in solder joints of LTCC modules

by Rautioaho, R., Nousiainen, O., Saven, T., Leppävuori, S., Lenkkeri, J.
Published in Microelectronics and reliability (01.08.2000)

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Journal Article

Texture Evolution During Cold Forming of Rectangular Hollow Section

Texture Evolution During Cold Forming of Rectangular Hollow Section

by Kaijalainen, A, Javaheri, V, Nousiainen, O, Tulonen, J, Steen, P, Kömi, J
Published in IOP conference series. Materials Science and Engineering (01.03.2021)

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Effect of ENIG deposition on the failure mechanisms of thermomechanically loaded leadfree 2nd level interconnections in LTCCPWB assemblies

Effect of ENIG deposition on the failure mechanisms of thermomechanically loaded leadfree 2nd level interconnections in LTCCPWB assemblies

by Nousiainen, O., Kangasvieri, T., Kautio, K., Rautioaho, R., Vhkangas, J.
Published in Soldering & surface mount technology (29.06.2010)

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