Modeling and Design Optimization of Ultrathin Vapor Chambers for High Heat Flux Applications
Ranjan, R., Murthy, J. Y., Garimella, S. V., Altman, D. H., North, M. T.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2012)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.09.2012)
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Journal Article
Effects of Datacenter Cooling Subsystems Performance on TUE: Air vs. Liquid vs. Hybrid Cooling
North, Mark T., Kulkarni, Amit, Haley, David
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28.05.2024)
Published in 2024 23rd IEEE Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (ITherm) (28.05.2024)
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Conference Proceeding
Thermal performance and flow instabilities in a multi-channel, helium-cooled, porous metal divertor module
Youchison, Dennis L, North, Mark T, Lindemuth, James E, McDonald, Jimmie M, Lutz, Thomas J
Published in Fusion engineering and design (01.11.2000)
Published in Fusion engineering and design (01.11.2000)
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Journal Article
Conference Proceeding
Reduced Power Precision Temperature Control Using Variable Conductance Heat Pipes
Cleary, Martin, North, Mark T., Van Lieshout, Matt, Brooks, David A., Grimes, Ronan, Hodes, Marc
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.12.2013)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.12.2013)
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Journal Article
Thermal Performance of a Dual-Channel, Helium-Cooled, Tungsten Heat Exchanger
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Journal Article
Conference Proceeding
Microfabrication of short pin fins on heat sink surfaces to augment heat transfer performance
Congshun Wang, Youmin Yu, Simon, T., Tianhong Cui, North, M. T.
Published in 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2012)
Published in 13th InterSociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (01.05.2012)
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Conference Proceeding