Search Results - "Noritake, Chikage" :: K.UTB vyhledávací portál

Effect of Ti Film against the Adhesion between Cu and TiN Film

by NORITAKE, Chikage, ISHIHARA, Yasuo, KONDO, Ichiharu, KONDO, Kenji, TAKENAKA, Osamu, KINBARA, Akira
Published in Hyōmen gijutsu (01.04.1997)

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Journal Article

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SEMICONDUCTOR PACKAGE

by NORITAKE CHIKAGE, TESHIMA TAKANORI
Year of Publication 23.01.2014

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Patent

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Transfer-molded power device and method for manufacturing transfer-molded power device

by HIRANO NAOHIKO, NAKASE YOSHIMI, NORITAKE CHIKAGE, YAGI KENJI, OOKURA YASUSHI, FUKUDA YUTAKA, MAMITSU KUNIAKI, NOMURA KAZUHITO, SUZUKI MIKIMASA, TESHIMA TAKANORI
Year of Publication 05.02.2003

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Patent

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LAMINATE OF SEMICONDUCTOR MODULE

by NORITAKE CHIKAGE, NAKAMURA MASAYA
Year of Publication 05.01.2012

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Patent

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SEMICONDUCTOR PACKAGE, AND METHOD OF MANUFACTURING THE SAME

by TEJIMA TAKANORI, NORITAKE CHIKAGE
Year of Publication 10.03.2011

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Patent

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Production method of semiconductor module with resin-molded assembly of heat spreader and semiconductor chip

by HIRAIWA NAOKI, NORITAKE CHIKAGE, ARAI TSUYOSHI
Year of Publication 10.09.2013

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Patent

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Method for manufacturing semiconductor power device

by NORITAKE CHIKAGE, SUZUKI MIKIMASA
Year of Publication 12.12.2006

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Patent

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Method for manufacturing semiconductor power device

by Suzuki, Mikimasa, Noritake, Chikage
Year of Publication 12.12.2006

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Patent

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SEMICONDUCTOR MODULE MANUFACTURING METHOD

by HIRAIWA NAOKI, ARAI TAKESHI, NORITAKE CHIKAGE
Year of Publication 12.01.2012

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Patent

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SEMICONDUCTOR MODULE

by HIRAIWA NAOKI, ARAI TAKESHI, NORITAKE CHIKAGE
Year of Publication 12.01.2012

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Patent

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PRODUCTION METHOD OF SEMICONDUCTOR MODULE WITH RESIN-MOLDED ASSEMBLY OF HEAT SPREADER AND SEMICONDUCTOR CHIP

by HIRAIWA NAOKI, NORITAKE CHIKAGE, ARAI TSUYOSHI
Year of Publication 29.12.2011

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Patent

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SEMICONDUCTOR MODULE WITH RESIN-MOLDED PACKAGE OF HEAT SPREADER AND POWER SEMICONDUCTOR CHIP

by HIRAIWA NAOKI, NORITAKE CHIKAGE, ARAI TSUYOSHI
Year of Publication 29.12.2011

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Patent

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Method for producing semiconductor power device

by SUZUKI KANMASA,NORITAKE CHIKAGE
Year of Publication 02.08.2006

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Patent

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Semiconductor module molded by resin with heat radiation plate opened outside from mold

by NORITAKE CHIKAGE, MAMITSU KUNIAKI, TESHIMA TAKANORI
Year of Publication 17.05.2011

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Patent

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Semiconductor module molded by resin with heat radiation plate opened outside from mold

by Noritake, Chikage, Teshima, Takanori, Mamitsu, Kuniaki
Year of Publication 17.05.2011

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Patent

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Semiconductor device including cooler

by NORITAKE CHIKAGE, KANEKO TAKAHISA, MAMITSU KUNIAKI, NISHIHATA MASAYOSHI, ITOH TOSHIKI, NOMURA EIJI, TONOMOTO MASAYA, WADO HIROYUKI
Year of Publication 30.06.2015

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Patent

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Verfahren zur Herstellung eines Leistungshalbleiterbauelements

by SUZUKI, MIKIMASA, NORITAKE, CHIKAGE
Year of Publication 10.01.2013

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Patent

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Semiconductor device including cooler

by NORITAKE CHIKAGE, KANEKO TAKAHISA, MAMITSU KUNIAKI, NISHIHATA MASAYOSHI, ITOH TOSHIKI, NOMURA EIJI, TONOMOTO MASAYA, WADO HIROYUKI
Year of Publication 17.02.2015

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Patent

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SEMICONDUCTOR DEVICE INCLUDING COOLER

by NORITAKE CHIKAGE, KANEKO TAKAHISA, MAMITSU KUNIAKI, NISHIHATA MASAYOSHI, ITOH TOSHIKI, NOMURA EIJI, TONOMOTO MASAYA, WADO HIROYUKI
Year of Publication 11.12.2014

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Patent

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Semiconductor device including cooler

by NORITAKE CHIKAGE, KANEKO TAKAHISA, MAMITSU KUNIAKI, NISHIHATA MASAYOSHI, ITOH TOSHIKI, NOMURA EIJI, TONOMOTO MASAYA, WADO HIROYUKI
Year of Publication 11.11.2014

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Patent

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