by Nordholz, P., Treytnar, D., Otterstedt, J., Grabinski, H., Niggemeyer, D., Williams, T.W.
Published in Proceedings. 16th IEEE VLSI Test Symposium (Cat. No.98TB100231) (1998)

by Nordholz, P., Grabinski, H., Treytnar, D., Otterstedt, J., Niggemeyer, D., Arz, U., Williams, T.W.
Published in Proceedings Design, Automation and Test in Europe (1998)

by Nordholz, P., Grabinski, H.
Published in Electrical Performance of Electronic Packaging (1997)

by Grabinski, H., Konrad, B., Nordholz, P.
Published in IEEE 7th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.98TH8370) (1998)

by Nordholz, P., Grabinski, H.
Published in IEEE transactions on components, packaging, and manufacturing technology. Part B, Advanced packaging (01.08.1998)

by Nordholz, P., Otterstedt, J., Niggemeyer, D.
Published in 1996 Proceedings. Eighth Annual IEEE International Conference on Innovative Systems in Silicon (1996)

by Nordholz, P., Grabinski, H., Treytnar, D., Otterstedt, J., Niggemeyer, D., Arz, U., Williams, T. W.
Published in Design, Automation, and Test in Europe: Proceedings of the conference on Design, automation and test in Europe; 23-26 Feb. 1998 (23.02.1998)

by Nordholz, P., Ktata, F.
Published in IEEE 8th Topical Meeting on Electrical Performance of Electronic Packaging (Cat. No.99TH8412) (1999)

by Knoth, C., Kleeberger, V.B., Nordholz, P., Schlichtmann, U.
Published in 2009 IEEE Behavioral Modeling and Simulation Workshop (01.09.2009)

by Knoth, C., Kleeberger, V.B., Nordholz, P., Schlichtmann, U.
Published in Proceedings of the 2009 12th International Symposium on Integrated Circuits (01.12.2009)