A footprint study of bond initiation in gold wire crescent bonding
Zhou, Y., Li, X., Noolu, N.J.
Published in IEEE transactions on components and packaging technologies (01.12.2005)
Published in IEEE transactions on components and packaging technologies (01.12.2005)
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Journal Article
Roughness Enhanced Au Ball Bonding of Cu Substrates
Noolu, N.J., Lum, I., Zhou, Y.
Published in IEEE transactions on components and packaging technologies (01.09.2006)
Published in IEEE transactions on components and packaging technologies (01.09.2006)
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Journal Article
Laser weldability of Pt and Ti alloys
Noolu, N.J., Kerr, H.W., Zhou, Y., Xie, J.
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (25.04.2005)
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (25.04.2005)
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Journal Article