Investigation of electrical characteristics of flexible CMOS devices fabricated with thickness-controlled spalling process
Park, Honghwi, Lim, Changhee, Noh, Yeho, Lee, Chang-Ju, Won, Heungsup, Jung, Jaedong, Choi, Muhan, Kim, Jae-Joon, Yoo, Hocheon, Park, Hongsik
Published in Solid-state electronics (01.11.2020)
Published in Solid-state electronics (01.11.2020)
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Journal Article
Layer-resolved release of epitaxial layers in III-V heterostructure via a buffer-free mechanical separation technique
Park, Honghwi, Won, Heungsup, Lim, Changhee, Zhang, Yuxuan, Han, Won Seok, Bae, Sung-Bum, Lee, Chang-Ju, Noh, Yeho, Lee, Junyeong, Lee, Jonghyung, Jung, Sunghwan, Choi, Muhan, Lee, Sunghwan, Park, Hongsik
Published in Science advances (21.01.2022)
Published in Science advances (21.01.2022)
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