Trajectory uniformity in fixed abrasive plane lapping of BK7 glass
Liu, Ning, Wu, Pengfei, Niu, Fengli, Li, Xue, Zhu, Yongwei
Published in International journal of advanced manufacturing technology (01.11.2023)
Published in International journal of advanced manufacturing technology (01.11.2023)
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Journal Article
Influence of agglomerated diamond abrasive wear on sapphire material removal behavior
Chen, Jiapeng, Zhu, Nannan, Niu, Fengli, Peng, Yanan, Su, Jianxiu, Zhu, Yongwei
Published in Diamond and related materials (01.10.2020)
Published in Diamond and related materials (01.10.2020)
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Journal Article
Friction and wear characteristics of agglomerated diamond abrasives and lapping performance of fixed agglomerated diamond pads
Wang, Zikun, Niu, Fengli, Wang, Zhankui, Li, Jun, Sun, Tao, Zhu, Yongwei
Published in Wear (15.04.2021)
Published in Wear (15.04.2021)
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Journal Article
Lapping performance of mixed-size agglomerated diamond abrasives in fixed abrasives pads
Niu, Fengli, Wang, Kerong, Sun, Tao, Zhou, Piao, Hu, Weidong, Zhu, Yongwei
Published in Diamond and related materials (01.10.2021)
Published in Diamond and related materials (01.10.2021)
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Journal Article
High efficiency polishing of silicon carbide by applying reactive non-aqueous fluids to fixed abrasive pads
Wang, Hanqiang, Niu, Fengli, Chen, Jiapeng, Jiang, Zhenlin, Wang, Wenjun, Bu, Zhengzheng, Wang, Xuehan, Li, Jun, Zhu, Yongwei, Sun, Tao
Published in Ceramics international (01.03.2022)
Published in Ceramics international (01.03.2022)
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Journal Article
Modeling and analysis of plastic abrasive jet flow characteristics
Zhao, Yangyang, Zhao, Xianrui, Chen, Xiaoming, Song, Jingfu, Cui, Yunsong, Niu, Fengli, Du, Xunbai, Lu, Wenzhuang, Zuo, Dunwen
Published in Journal of manufacturing processes (15.08.2024)
Published in Journal of manufacturing processes (15.08.2024)
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Journal Article
Single crystal silicon wafer polishing by pretreating pad adsorbing SiO2 grains and abrasive-free slurries
Bu, Zhengzheng, Niu, Fengli, Chen, Jiapeng, Jiang, Zhenlin, Wang, Wenjun, Wang, Xuehan, Wang, Hanqiang, Zhang, Zefang, Zhu, Yongwei, Sun, Tao
Published in Materials science in semiconductor processing (01.04.2022)
Published in Materials science in semiconductor processing (01.04.2022)
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Journal Article
Prediction of subsurface microcrack depth of brittle materials based on co-training SVR
Chuang REN, Xin SHENG, Fengli NIU, Yongwei ZHU
Published in Jin gang shi yu mo liao mo ju gong cheng (01.12.2023)
Published in Jin gang shi yu mo liao mo ju gong cheng (01.12.2023)
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Journal Article
Comparison of lapping performance between diamond magnetic abrasives and silicon carbide magnetic abrasives
Yanhui DONG, Fengli NIU, Ze REN, Xin SHENG, Yongwei ZHU
Published in Jin gang shi yu mo liao mo ju gong cheng (01.06.2023)
Published in Jin gang shi yu mo liao mo ju gong cheng (01.06.2023)
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