Ground Contact of Bendable FPC EMI Film Impact on Desense Noise for Smart Glasses
Nieh, Chien-Ming Jemmy, Pai, Deepak, Park, Jay, Yamauchi, Shiro, Ito, Nobuyuki
Published in 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI) (29.07.2023)
Published in 2023 IEEE Symposium on Electromagnetic Compatibility & Signal/Power Integrity (EMC+SIPI) (29.07.2023)
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