Species swarms and their caterpillar colonisers: phylogeny and polyphenols determine host plant specificity in New Guinean Lepidoptera
Segar, Simon T., Re Jorge, Leonardo, Nicholls, Louis, Basset, Yves, Rota, Jadranka, Kaman, Ondrej, Sisol, Mentap, Gewa, Bradley, Dahl, Chris, Butterill, Phillip, Mezzomo, Priscila, Miller, Scott E., Weiblen, George, Salminen, Juha-Pekka, Novotny, Vojtech, Volf, Martin
Published in Frontiers in ecology and evolution (08.01.2024)
Published in Frontiers in ecology and evolution (08.01.2024)
Get full text
Journal Article
FINE PITCH COPPER PILLAR PACKAGE AND METHOD
McCann, David, Nicholls, Louis W, Darveaux, Robert Francis, McCormick, John
Year of Publication 16.06.2022
Get full text
Year of Publication 16.06.2022
Patent
Fine pitch copper pillar package and method
McCann, David, Nicholls, Louis W, Darveaux, Robert Francis, McCormick, John
Year of Publication 10.08.2021
Get full text
Year of Publication 10.08.2021
Patent
FINE PITCH COPPER PILLAR PACKAGE AND METHOD
McCann, David, Nicholls, Louis W, Darveaux, Robert Francis, McCormick, John
Year of Publication 09.07.2020
Get full text
Year of Publication 09.07.2020
Patent
Methods and structures for increasing the allowable die size in TMV packages
Darveaux, Robert F, Jung, Woon Kab, St. Amand, Roger D, Nicholls, Louis W, Kim, Jin Seong, Yang, Sung Jin
Year of Publication 01.11.2022
Get full text
Year of Publication 01.11.2022
Patent
Fine pitch copper pillar package and method
McCann, David, Nicholls, Louis W, Darveaux, Robert Francis, McCormick, John
Year of Publication 17.09.2019
Get full text
Year of Publication 17.09.2019
Patent
Fine pitch copper pillar package and method
McCann, David, Nicholls, Louis W, Darveaux, Robert Francis, McCormick, John
Year of Publication 05.03.2019
Get full text
Year of Publication 05.03.2019
Patent
METHODS AND STRUCTURES FOR INCREASING THE ALLOWABLE DIE SIZE IN TMV PACKAGES
Darveaux, Robert F, Jung, Woon Kab, St. Amand, Roger D, Nicholls, Louis W, Kim, Jin Seong, Yang, Sung Jin
Year of Publication 03.06.2021
Get full text
Year of Publication 03.06.2021
Patent
Semiconductor devices and methods of making semiconductor devices
Darveaux, Robert F, Jung, Woon Kab, St. Amand, Roger D, Nicholls, Louis W, Kim, Jin Seong, Yang, Sung Jin
Year of Publication 14.07.2020
Get full text
Year of Publication 14.07.2020
Patent
METHODS AND STRUCTURES FOR INCREASING THE ALLOWABLE DIE SIZE IN TMV PACKAGES
Darveaux, Robert F, Jung, Woon Kab, St. Amand, Roger D, Nicholls, Louis W, Kim, Jin Seong, Yang, Sung Jin
Year of Publication 05.12.2019
Get full text
Year of Publication 05.12.2019
Patent
Fine pitch copper pillar package and method
McCann David, McCormick John, Darveaux Robert Francis, Nicholls Louis W
Year of Publication 04.10.2016
Get full text
Year of Publication 04.10.2016
Patent
Methods and structures for increasing the allowable die size in TMV packages
Darveaux, Robert F, Jung, Woon Kab, St. Amand, Roger D, Nicholls, Louis W, Kim, Jin Seong, Yang, Sung Jin
Year of Publication 09.07.2019
Get full text
Year of Publication 09.07.2019
Patent
Methods and structures for increasing the allowable die size in TMV packages
Yang Sung Jin, St. Amand Roger D, Jung Woon Kab, Nicholls Louis W, Darveaux Robert F, Kim Jin Seong
Year of Publication 01.08.2017
Get full text
Year of Publication 01.08.2017
Patent
Fine pitch copper pillar package and method
MCCORMICK JOHN, DARVEAUX ROBERT FRANCIS, MCCANN DAVID, NICHOLLS LOUIS W
Year of Publication 17.09.2013
Get full text
Year of Publication 17.09.2013
Patent