Architecture of Cobweb-Based Redundant TSV for Clustered Faults
Ni, Tianming, Liu, Dongsheng, Xu, Qi, Huang, Zhengfeng, Liang, Huaguo, Yan, Aibin
Published in IEEE transactions on very large scale integration (VLSI) systems (01.07.2020)
Published in IEEE transactions on very large scale integration (VLSI) systems (01.07.2020)
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Journal Article
Information Assurance Through Redundant Design: A Novel TNU Error-Resilient Latch for Harsh Radiation Environment
Yan, Aibin, Hu, Yuanjie, Cui, Jie, Chen, Zhili, Huang, Zhengfeng, Ni, Tianming, Girard, Patrick, Wen, Xiaoqing
Published in IEEE transactions on computers (01.06.2020)
Published in IEEE transactions on computers (01.06.2020)
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Journal Article
LCHR-TSV: Novel Low Cost and Highly Repairable Honeycomb-Based TSV Redundancy Architecture for Clustered Faults
Ni, Tianming, Yao, Yao, Chang, Hao, Lu, Lin, Liang, Huaguo, Yan, Aibin, Huang, Zhengfeng, Wen, Xiaoqing
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01.10.2020)
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01.10.2020)
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Journal Article
Non-Intrusive Online Distributed Pulse Shrinking-Based Interconnect Testing in 2.5D IC
Ni, Tianming, Chang, Hao, Song, Tai, Xu, Qi, Huang, Zhengfeng, Liang, Huaguo, Yan, Aibin, Wen, Xiaoqing
Published in IEEE transactions on circuits and systems. II, Express briefs (01.11.2020)
Published in IEEE transactions on circuits and systems. II, Express briefs (01.11.2020)
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Journal Article
A Methodology for Characterization of SET Propagation in SRAM-Based FPGAs
Liang, Huaguo, Xu, Xiumin, Huang, Zhengfeng, Jiang, Cuiyun, Lu, Yingchun, Yan, Aibin, Ni, Tianming, Ouyang, Yiming, Yi, Maoxiang
Published in IEEE transactions on nuclear science (01.12.2016)
Published in IEEE transactions on nuclear science (01.12.2016)
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Journal Article
Pattern Reorder for Test Cost Reduction Through Improved SVMRANK Algorithm
Song, Tai, Liang, Huaguo, Ni, Tianming, Huang, Zhengfeng, Lu, Yingchun, Wan, Jinlei, Yan, Aibin
Published in IEEE access (01.01.2020)
Published in IEEE access (01.01.2020)
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Journal Article
Temperature-Aware Floorplanning for Fixed-Outline 3D ICs
Ni, Tianming, Chang, Hao, Zhu, Shidong, Lu, Lin, Li, Xueyun, Xu, Qi, Liang, Huaguo, Huang, Zhengfeng
Published in IEEE access (2019)
Published in IEEE access (2019)
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Journal Article
Performance analysis and optimization of cascade waste heat recovery system based on transcritical CO2 cycle for waste heat recovery in waste-to-energy plant
Ni, Tianming, Si, Junwei, Lu, Fulu, Zhu, Yan, Pan, Mingzhang
Published in Journal of cleaner production (10.01.2022)
Published in Journal of cleaner production (10.01.2022)
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Journal Article
A Test Method for Large-size TSV Considering Resistive Open Fault and Leakage Fault Coexistence
Hao, Chang, Yong, Xu, Tianming, Ni
Published in 2021 International Symposium on VLSI Design, Automation and Test (VLSI-DAT) (19.04.2021)
Published in 2021 International Symposium on VLSI Design, Automation and Test (VLSI-DAT) (19.04.2021)
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Conference Proceeding
A Soft-Error-Immune Quadruple-Node-Upset Tolerant Latch
Huang, Zhengfeng, Duan, Lanxi, Zhang, Yan, Ni, Tianming, Yan, Aibin
Published in IEEE transactions on aerospace and electronic systems (01.06.2023)
Published in IEEE transactions on aerospace and electronic systems (01.06.2023)
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Journal Article
Designs of Two Quadruple-Node-Upset Self-Recoverable Latches for Highly Robust Computing in Harsh Radiation Environments
Yan, Aibin, Li, Zhixing, Cui, Jie, Huang, Zhengfeng, Ni, Tianming, Girard, Patrick, Wen, Xiaoqing
Published in IEEE transactions on aerospace and electronic systems (01.06.2023)
Published in IEEE transactions on aerospace and electronic systems (01.06.2023)
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Journal Article
Design Guidelines and Feedback Structure of Ring Oscillator PUF for Performance Improvement
Huang, Zhengfeng, Bian, Jingchang, Lin, Yankun, Liang, Huaguo, Ni, Tianming
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01.01.2024)
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01.01.2024)
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Journal Article
Kelvin Bridge Structure Based TSV Test for Weak Faults
Hao, Chang, Zhengfeng, Huang, Tianming, Ni
Published in 2021 IEEE International Test Conference in Asia (ITC-Asia) (18.08.2021)
Published in 2021 IEEE International Test Conference in Asia (ITC-Asia) (18.08.2021)
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Conference Proceeding
LDAVPM: A Latch Design and Algorithm-based Verification Protected against Multiple-Node-Upsets in Harsh Radiation Environments
Yan, Aibin, Li, Zhixing, Cui, Jie, Huang, Zhengfeng, Ni, Tianming, Girard, Patrick, Wen, Xiaoqing
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01.06.2023)
Published in IEEE transactions on computer-aided design of integrated circuits and systems (01.06.2023)
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Journal Article
Nonvolatile Latch Designs With Node-Upset Tolerance and Recovery Using Magnetic Tunnel Junctions and CMOS
Yan, Aibin, Wang, Litao, Cui, Jie, Huang, Zhengfeng, Ni, Tianming, Girard, Patrick, Wen, Xiaoqing
Published in IEEE transactions on very large scale integration (VLSI) systems (01.01.2024)
Published in IEEE transactions on very large scale integration (VLSI) systems (01.01.2024)
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Journal Article