Development of a Spatial Heterodyne Terahertz Raman Spectrometer with Echelle Gratings
Sun, Yuqi, Li, Xiaotian, Galantu, Jiri, Chu, Qihang, Chen, Jun, Li, Fuguan, Song, Nan, Wang, Geng, Ni, Qiliang
Published in Applied sciences (01.01.2023)
Published in Applied sciences (01.01.2023)
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Journal Article
Space solar telescope in soft X-ray and EUV band
Chen, Bo, Liu, Zhen, Yang, Lin, Gao, Liang, He, Fei, Wang, XiaoGuang, Ni, QiLiang
Published in Science China. Physics, mechanics & astronomy (01.11.2009)
Published in Science China. Physics, mechanics & astronomy (01.11.2009)
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Journal Article
A 7.4 kHz, 20-bit image encoder with a CMOS linear image sensor
Mu, Yusong, Jiang, Jiaqi, Ding, Ning, Ni, Qiliang, Chang, Yuchun
Published in Optical and quantum electronics (01.10.2019)
Published in Optical and quantum electronics (01.10.2019)
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Journal Article
Noise analysis of the Vernier anode
Zhao, Airong, Ni, Qiliang, Yu, Weixing
Published in Applied optics. Optical technology and biomedical optics (01.08.2015)
Published in Applied optics. Optical technology and biomedical optics (01.08.2015)
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Journal Article
Biosurfactant-facilitated biodegradation of hydrophobic organic compounds in hydraulic fracturing flowback wastewater: A dose–effect analysis
Huang, Xiaomin, Zhou, Hanghai, Ni, Qiliang, Dai, Chuhan, Chen, Chunlei, Li, Yanhong, Zhang, Chunfang
Published in Environmental technology & innovation (01.08.2020)
Published in Environmental technology & innovation (01.08.2020)
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Journal Article
The analysis and reduction of auto focus failure of advanced darkfiled inspection system
Yuan, Zengyi, Ni, Qiliang, Chen, Hunglin, Long, Yin
Published in 2015 China Semiconductor Technology International Conference (01.03.2015)
Published in 2015 China Semiconductor Technology International Conference (01.03.2015)
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Conference Proceeding
Journal Article
The detection and investigation of SRAM data retention soft failures by voltage contrast inspection
Fan, Rongwei, Chen, Hunglin, Long, Yin, Ni, Qiliang, Wang, Kai, He, Zhibin, Yang, Zhengkai, Wang, Yanyun, Ni, Liang
Published in 2015 China Semiconductor Technology International Conference (01.03.2015)
Published in 2015 China Semiconductor Technology International Conference (01.03.2015)
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Conference Proceeding
Journal Article
Wafer Edge Process Integration and Defect Inspection with the Immersion Lithography Process
Ni, Qiliang, Chen, Hunglin, Wang, Kai, Long, Yin, Fang, Rongwei
Published in ECS transactions (27.02.2014)
Published in ECS transactions (27.02.2014)
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Journal Article
The High Electron Dose of Voltage Contrast Inspection for the Detection of Nickel Silicide Piping Defects
Wang, Kai, Chen, Hunglin, Long, Yin, Ni, Qiliang, Fan, Rongwei
Published in ECS transactions (27.02.2014)
Published in ECS transactions (27.02.2014)
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Journal Article
Methodology and Application of the Detection of Invisible Defect by Voltage Contrast Inspection
Fan, Rongwei, Chen, Hunglin, Long, Yin, Ni, Qiliang, Wang, Kai, Gu, Xiaofang
Published in ECS transactions (27.02.2014)
Published in ECS transactions (27.02.2014)
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Journal Article
Different Module's Process Affect to Poly Pattern Etch Stick Particle
Fu, Jiayi, Ni, Qiliang, Han, Chao
Published in 2022 China Semiconductor Technology International Conference (CSTIC) (20.06.2022)
Published in 2022 China Semiconductor Technology International Conference (CSTIC) (20.06.2022)
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Conference Proceeding
The Improvement Study of UTS CIS Bevel Peeling Defect Based on the Application of SEM API
Hu, Xianghua, He, Guangzhi, Wang, Jingfeng, Ni, Qiliang
Published in 2023 China Semiconductor Technology International Conference (CSTIC) (26.06.2023)
Published in 2023 China Semiconductor Technology International Conference (CSTIC) (26.06.2023)
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Conference Proceeding
Stress adjusting for hillock size reduction in UTS CIS base on graphics analysis
Hu, Xianghua, He, Guangzhi, Gu, Xiaofang, Ni, Qiliang
Published in 2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) (08.04.2021)
Published in 2021 5th IEEE Electron Devices Technology & Manufacturing Conference (EDTM) (08.04.2021)
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Conference Proceeding
Metal Trench Critical Dimension and Overlay Minor Variation Monitoring Method with Voltage Contrast Inspection
Huang, Lijing, Ni, Qiliang, Gu, Xiaofang, Han, Chao, Yuan, Jiansi
Published in 2020 China Semiconductor Technology International Conference (CSTIC) (26.06.2020)
Published in 2020 China Semiconductor Technology International Conference (CSTIC) (26.06.2020)
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Conference Proceeding