Ultra-wide effective absorption bandwidth of Cu, Co, and Ti co-doped SrFe12O19 hexaferrite
Tho, P.T., Xuan, C.T.A., Tran, N., Tuan, N.Q., Jeong, W.H., Kim, S.W., Dat, T.Q., Nguyen, V.D., Bach, T.N., Thanh, T.D., Khan, D.T., Lee, B.W.
Published in Ceramics international (01.10.2022)
Published in Ceramics international (01.10.2022)
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Journal Article
Selective operations of multi-pillar SOT-MRAM for high density and low power embedded memories
Cai, K., Van Beek, S., Rao, S., Fan, K., Gupta, M., Nguyen, V.D., Jayakumar, G., Talmelli, G., Couet, S., Kar, G.S.
Published in 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) (12.06.2022)
Published in 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) (12.06.2022)
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Conference Proceeding
Larvicidal activity of Vietnamese Solanum nigrum on mosquitoes Aedes aegypti and Aedes albopictus (Diptera: Culicidae)
Dinh, T.D.H., Le, Q.T., Nguyen, T.D., Nguyen, T.Q.T., Ho, A.S., Nguyen, V.B., Nguyen, T.V., Hoang, T.H., Nguyen, V.D., Nguyen, K.L.
Published in Journal of entomological and acarological research (29.05.2020)
Published in Journal of entomological and acarological research (29.05.2020)
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Journal Article
A study on the composite dielectric properties for an HTS cable
Kwag, D.S., Nguyen, V.D., Baek, S.M., Kim, H.J., Cho, J.W., Kim, S.H.
Published in IEEE transactions on applied superconductivity (01.06.2005)
Published in IEEE transactions on applied superconductivity (01.06.2005)
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Journal Article
Conference Proceeding
Magnetic domain walls: from physics to devices
Raymenants, E., Wan, D., Couet, S., Canvel, Y., Thiam, A., Tsvetanova, D., Souriau, L., Asselberghs, I., Carpenter, R., Jossart, N., Manfrini, M., Vaysset, A., Bultynck, O., Van Beek, S., Heyns, M., Nikonov, D.E., Young, I.A., Ghosh, S., Vila, L., Garello, K., Pizzini, S., Nguyen, V.D., Radu, I.P.
Published in 2021 IEEE International Electron Devices Meeting (IEDM) (11.12.2021)
Published in 2021 IEEE International Electron Devices Meeting (IEDM) (11.12.2021)
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Conference Proceeding
All-electrical control of scaled spin logic devices based on domain wall motion
Raymenants, E., Wan, D., Couet, S., Souriau, L., Thiam, A., Tsvetanova, D., Canvel, Y., Asselberghs, I., Heyns, M., Nikonov, D.E., Young, I.A., Pizzini, S., Nguyen, V.D., Radu, I.P.
Published in 2020 IEEE International Electron Devices Meeting (IEDM) (12.12.2020)
Published in 2020 IEEE International Electron Devices Meeting (IEDM) (12.12.2020)
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Conference Proceeding
Controlling the Structure and Length of Self-Synthesizing Supramolecular Polymers through Nucleated Growth and Disassembly
Pal, Asish, Malakoutikhah, Morteza, Leonetti, Giulia, Tezcan, Meniz, Colomb-Delsuc, Mathieu, Nguyen, Van Duc, van der Gucht, Jasper, Otto, Sijbren
Published in Angewandte Chemie (International ed.) (26.06.2015)
Published in Angewandte Chemie (International ed.) (26.06.2015)
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Journal Article
Critical Casimir forces for colloidal assembly
Nguyen, V D, Dang, M T, Nguyen, T A, Schall, P
Published in Journal of physics. Condensed matter (03.02.2016)
Published in Journal of physics. Condensed matter (03.02.2016)
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Journal Article
A critical analysis of customs-business partnership compliance the import and export enterprises with customs law and regulation/Analisis critico de la asociacion aduanera-empresarial y cumplimiento de las empresas de importacion y exportacion con la ley aduanera y la regulacion
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Study of optical properties and energy transfer mechanism of Tb3+, Sm3+ singly doped and co-doped ZnS quantum dots
Tan, P.M., Ngoc, T., Nguyen, V.D., Hien, N.T., Hoa, V.X., Truong, N.X., Oanh, V.T.K., Tam, N.D., Ca, N.X., Bharti, S., Peng, Y.
Published in Optical materials (01.04.2021)
Published in Optical materials (01.04.2021)
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Journal Article
Analysis of the Genetic Diversity of Radish Germplasm through SSR Markers Derived from Chinese Cabbage
Park, S.H., National Institute of horticultural and Herbal Science, Suwon, Republic of Korea, Choi, S.R., Chungnam National University, Daejeon, Republic of Korea, Lee, J.S., National Institute of horticultural and Herbal Science, Suwon, Republic of Korea, Nguyen, V.D., Chonnam National University, Gwangju, Republic of Korea, Kim, S.G., Chungnam National University, Daejeon, Republic of Korea, Lim, Y.P., Chonnam National University, Gwangju, Republic of Korea
Published in Weon'ye gwahag gi'sulji (01.08.2013)
Published in Weon'ye gwahag gi'sulji (01.08.2013)
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Journal Article
Extremely Scaled Perpendicular SOT-MRAM Array Integration on 300mm Wafer
Yasin, F., Palomino, A., Kumar, A., Pica, V., Van Beek, S., Talmelli, G., Nguyen, V.D., Cosemans, S., Crotti, D., Wostyn, K., Kar, G. S., Couet, S.
Published in 2024 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) (16.06.2024)
Published in 2024 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) (16.06.2024)
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Conference Proceeding
Chloroplast capture and range extension after hybridization in taro (Colocasia esculenta)
Matthews, P. J., Hossain, M. A., Sookchaloem, D., Nguyen, V. D., Wong, S. Y., Joling, J., Schranz, M. E., Bakker, F. T., Tabuchi, E., Ahmed, I., Hay, A.
Published in Ecology and evolution (01.08.2024)
Published in Ecology and evolution (01.08.2024)
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Journal Article
BEOL compatible high retention perpendicular SOT-MRAM device for SRAM replacement and machine learning
Couet, S., Rao, S., Van Beek, S., Nguyen, V.D., Garello, K., Kateel, V., Jayakumar, G., Costa, J.D., Cai, K., Yasin, F., Crotti, D., Kar, G.S.
Published in 2021 Symposium on VLSI Technology (13.06.2021)
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Published in 2021 Symposium on VLSI Technology (13.06.2021)
Conference Proceeding
Trichinella infection in wild boars and synanthropic rats in northwest Vietnam
Thi, N Vu, Nguyen, V D, Praet, N, Claes, L, Gabriël, S, Huyen, N T, Dorny, P
Published in Veterinary parasitology (24.02.2014)
Published in Veterinary parasitology (24.02.2014)
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Journal Article
Discrete modeling of granular flow with thermal transfer: Application to the discharge of silos
Nguyen, V.D., Cogné, C., Guessasma, M., Bellenger, E., Fortin, J.
Published in Applied thermal engineering (01.06.2009)
Published in Applied thermal engineering (01.06.2009)
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