3-D Sequential Stacked Planar Devices Featuring Low-Temperature Replacement Metal Gate Junctionless Top Devices With Improved Reliability
Vandooren, A., Franco, J., Parvais, B., Wu, Z., Witters, L., Walke, A., Li, W., Peng, L., Deshpande, V., Bufler, F. M., Rassoul, N., Hellings, G., Jamieson, G., Inoue, F., Verbinnen, G., Devriendt, K., Teugels, L., Heylen, N., Vecchio, E., Zheng, T., Rosseel, E., Vanherle, W., Hikavyy, A., Chan, B. T., Ritzenthaler, R., Besnard, G., Schwarzenbach, W., Gaudin, G., Radu, I., Nguyen, B.-Y., Waldron, N., De Heyn, V., Mocuta, D., Collaert, N.
Published in IEEE transactions on electron devices (01.11.2018)
Published in IEEE transactions on electron devices (01.11.2018)
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Crystallization in hafnia- and zirconia-based systems
Ushakov, S. V., Navrotsky, A., Yang, Y., Stemmer, S., Kukli, K., Ritala, M., Leskelä, M. A., Fejes, P., Demkov, A., Wang, C., Nguyen, B.-Y., Triyoso, D., Tobin, P.
Published in Physica Status Solidi (b) (01.08.2004)
Published in Physica Status Solidi (b) (01.08.2004)
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Impact of a 10 nm ultra-thin BOX (UTBOX) and ground plane on FDSOI devices for 32 nm node and below
Fenouillet-Beranger, C., Perreau, P., Denorme, S., Tosti, L., Andrieu, F., Weber, O., Monfray, S., Barnola, S., Arvet, C., Campidelli, Y., Haendler, S., Beneyton, R., Perrot, C., de Buttet, C., Gros, P., Pham-Nguyen, L., Leverd, F., Gouraud, P., Abbate, F., Baron, F., Torres, A., Laviron, C., Pinzelli, L., Vetier, J., Borowiak, C., Margain, A., Delprat, D., Boedt, F., Bourdelle, K., Nguyen, B.-Y., Faynot, O., Skotnicki, T.
Published in Solid-state electronics (01.09.2010)
Published in Solid-state electronics (01.09.2010)
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Conference Proceeding
Extraction of Isothermal Condition and Thermal Network in UTBB SOI MOSFETs
Karim, M. A., Chauhan, Y. S., Venugopalan, S., Sachid, A. B., Lu, D. D., Nguyen, B. Y., Faynot, O., Niknejad, A. M., Hu, C.
Published in IEEE electron device letters (01.09.2012)
Published in IEEE electron device letters (01.09.2012)
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Advanced FD-SOI and Beyond Low Temperature SmartCut™ Enables High Density 3-D SoC Applications
Schwarzenbach, W., Daval, N., Maleville, C., Nguyen, B.-Y., Ecarnot, L., Loubriat, S., Detard, M., Cela, E., Bertrand-Giuliani, C., Chabanne, G., Maddalon, C.
Published in IEEE journal of the Electron Devices Society (2019)
Published in IEEE journal of the Electron Devices Society (2019)
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Journal Article
22FD-SOI Variability Improvement Thanks to SmartCut Thickness Control at Atomic Scale
Schwarzenbach, W., Loubriat, L., Joseph, V., Viravaux, L., Moreau, O., Lasserre, S., Nguyen, B.-Y.
Published in ESSDERC 2019 - 49th European Solid-State Device Research Conference (ESSDERC) (01.09.2019)
Published in ESSDERC 2019 - 49th European Solid-State Device Research Conference (ESSDERC) (01.09.2019)
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Conference Proceeding
Demonstration of 3D sequential FD-SOI on CMOS FinFET stacking featuring low temperature Si layer transfer and top tier device fabrication with tier interconnections
Vandooren, A., Parihar, N., Franco, J., Loo, R., Arimura, H., Rodriguez, R., Sebaai, F., Iacovo, S., Vandersmissen, K., Li, W., Mannaert, G., Radisic, D., Rosseel, E., Hikavyy, A., Jourdain, A., Mourey, O., Gaudin, G., Reboh, S., Van-Jodin, L. Le, Besnard, G., Neve, C. Roda, Nguyen, B-Y., Radu, I., Litta, E. Dentoni, Horiguchi, N.
Published in 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) (12.06.2022)
Published in 2022 IEEE Symposium on VLSI Technology and Circuits (VLSI Technology and Circuits) (12.06.2022)
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Conference Proceeding
Transistors on hybrid UTBB/Bulk substrates fabricated by local internal BOX dissolution
Nguyen, P., Andrieu, F., Cassé, M., Tabone, C., Perreau, P., Lafond, D., Dansas, H., Tosti, L., Veytizou, C., Landru, D., Kononchuk, O., Guiot, E., Nguyen, B.-Y., Faynot, O., Poiroux, T.
Published in Solid-state electronics (01.12.2013)
Published in Solid-state electronics (01.12.2013)
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Conference Proceeding
Buried metal line compatible with 3D sequential integration for top tier planar devices dynamic Vth tuning and RF shielding applications
Vandooren, A., Wu, Z., Khaled, A., Franco, J., Parvais, B., Li, W., Witters, L., Walke, A., Peng, L., Rassoul, N., Matagne, P., Debruyn, H., Jamieson, G., Inoue, F., Devriendt, K., Teugels, L., Heylen, N., Vecchio, E., Zheng, T., Radisic, D., Rosseel, E., Vanherle, W., Hikavyy, A., Chan, B. T., Besnard, G., Schwarzenbach, W., Gaudin, G., Radu, I., Nguyen, B.-Y., Waldron, N., De Heyn, V., Demuynck, S., Boemmels, J., Ryckaert, J., Collaert, N., Mocuta, D.
Published in 2019 Symposium on VLSI Technology (01.06.2019)
Published in 2019 Symposium on VLSI Technology (01.06.2019)
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Conference Proceeding
Low leakage and low variability Ultra-Thin Body and Buried Oxide (UT2B) SOI technology for 20nm low power CMOS and beyond
Andrieu, F, Weber, O, Mazurier, J, Thomas, O, Noel, J.-P, Fenouillet-Béranger, C, Mazellier, J.-P, Perreau, P, Poiroux, T, Morand, Y, Morel, T, Allegret, S, Loup, V, Barnola, S, Martin, F, Damlencourt, J.-F, Servin, I, Cassé, M, Garros, X, Rozeau, O, Jaud, M.-A, Cibrario, G, Cluzel, J, Toffoli, A, Allain, F, Kies, R, Lafond, D, Delaye, V, Tabone, C, Tosti, L, Brévard, L, Gaud, P, Paruchuri, V, Bourdelle, K K, Schwarzenbach, W, Bonnin, O, Nguyen, B.-Y, Doris, B, Bœuf, F, Skotnicki, T, Faynot, O
Published in 2010 Symposium on VLSI Technology (01.06.2010)
Published in 2010 Symposium on VLSI Technology (01.06.2010)
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Conference Proceeding
Safety and tolerability of caspofungin acetate in the treatment of fungal infections
Sable, C.A., Nguyen, B-Y T., Chodakewitz, J.A., DiNubile, M.J.
Published in Transplant infectious disease (01.03.2002)
Published in Transplant infectious disease (01.03.2002)
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Dual strained channel CMOS in FDSOI architecture: New insights on the device performance
Le Royer, C., Cassé, M., Cooper, D., Andrieu, F., Weber, O., Brevard, L., Perreau, P., Damlencourt, J.-F., Baudot, S., Prévitali, B., Tabone, C., Allain, F., Scheiblin, P., Rauer, C., Figuet, C., Aulnette, C., Daval, N., Nguyen, B.-Y., Bourdelle, K.K., Gyani, J., Valenza, M.
Published in Solid-state electronics (01.11.2011)
Published in Solid-state electronics (01.11.2011)
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Conference Proceeding
Study of substrate orientations impact on Ultra Thin Buried Oxide (UTBOX) FDSOI High-K Metal gate technology performances
Ben Akkez, Imed, Fenouillet-Beranger, Claire, Cros, Antoine, Perreau, Pierre, Haendler, Sébatien, Weber, Olivier, Andrieu, François, Pellissier-Tanon, D., Abbate, F., Richard, C., Beneyton, R., Gouraud, P., Margain, A., Borowiak, C., Gourvest, E., Bourdelle, K.K., Nguyen, B.Y., Poiroux, T., Skotnicki, Thomas, Faynot, Olivier, Balestra, Francis, Ghibaudo, Gérard, Boeuf, Fréderic
Published in Solid-state electronics (01.12.2013)
Published in Solid-state electronics (01.12.2013)
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Conference Proceeding
Strain engineered extremely thin SOI (ETSOI) for high-performance CMOS
Khakifirooz, A., Cheng, K., Nagumo, T., Loubet, N., Adam, T., Reznicek, A., Kuss, J., Shahrjerdi, D., Sreenivasan, R., Ponoth, S., He, H., Kulkarni, P., Liu, Q., Hashemi, P., Khare, P., Luning, S., Mehta, S., Gimbert, J., Zhu, Y., Zhu, Z., Li, J., Madan, A., Levin, T., Monsieur, F., Yamamoto, T., Naczas, S., Schmitz, S., Holmes, S., Aulnette, C., Daval, N., Schwarzenbach, W., Nguyen, B.-Y, Paruchuri, V., Khare, M., Shahidi, G., Doris, B.
Published in 2012 Symposium on VLSI Technology (VLSIT) (01.06.2012)
Published in 2012 Symposium on VLSI Technology (VLSIT) (01.06.2012)
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Conference Proceeding
Understanding and optimizing the floating body retention in FDSOI UTBOX
Aoulaiche, M., Simoen, E., Caillat, C., Witters, L., Bourdelle, K.K., Nguyen, B.-Y., Martino, J., Claeys, C., Fazan, P., Jurczak, M.
Published in Solid-state electronics (01.03.2016)
Published in Solid-state electronics (01.03.2016)
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Journal Article
A process/physics-based compact model for nonclassical CMOS device and circuit design
Fossum, J.G., Ge, L., Chiang, M.-H., Trivedi, V.P., Chowdhury, M.M., Mathew, L., Workman, G.O., Nguyen, B.-Y.
Published in Solid-state electronics (01.06.2004)
Published in Solid-state electronics (01.06.2004)
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Journal Article
Impact of alternate definitions of fever resolution on the composite endpoint in clinical trials of empirical antifungal therapy for neutropenic patients with persistent fever: analysis of results from the Caspofungin Empirical Therapy Study
De Pauw, B.E., Sable, C.A., Walsh, T.J., Lupinacci, R.J., Bourque, M.R., Wise, B.A., Nguyen, B.-Y., DiNubile, M.J., Teppler, H.
Published in Transplant infectious disease (01.03.2006)
Published in Transplant infectious disease (01.03.2006)
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Journal Article
Coupling effects and channels separation in FinFETs
Daugé, F., Pretet, J., Cristoloveanu, S., Vandooren, A., Mathew, L., Jomaah, J., Nguyen, B.-Y.
Published in Solid-state electronics (01.04.2004)
Published in Solid-state electronics (01.04.2004)
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Journal Article
A Self-Rectifying AlOy Bipolar RRAM With Sub-50-μA Set/Reset Current for Cross-Bar Architecture
TRAN, X. A, ZHU, W, LIU, W. J, YEO, Y. C, NGUYEN, B. Y, HONG YU YU
Published in IEEE electron device letters (01.10.2012)
Published in IEEE electron device letters (01.10.2012)
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Journal Article
Fully-depleted SOI devices with TaSiN gate, HfO2 gate dielectric, and elevated source/drain extensions
Vandooren, A., Barr, A., Mathew, L., White, T.R., Egley, S., Pham, D., Zavala, M., Samavedam, S., Schaeffer, J., Conner, J., Nguyen, B.-Y., White, B.E., Orlowski, M.K., Mogab, J.
Published in IEEE electron device letters (01.05.2003)
Published in IEEE electron device letters (01.05.2003)
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