Search Results - "Ng Chee Yang" :: K.UTB vyhledávací portál | TBU Library Retrieval Portal

Removal of Cr (VI), As (V), Cu (II), and Pb (II) using cellulose biochar supported iron nanoparticles: A kinetic and mechanistic study

Removal of Cr (VI), As (V), Cu (II), and Pb (II) using cellulose biochar supported iron nanoparticles: A kinetic and mechanistic study

by Neeli, Sai Teja, Ramsurn, Hema, Ng, Chee Yang, Wang, Yanqing, Lu, Jun
Published in Journal of environmental chemical engineering (01.10.2020)

Get full text

Journal Article

Front end wafer Scanning Infra Red Depolarization (SIRD) measurement correlation to back end wafer backside finishing

Front end wafer Scanning Infra Red Depolarization (SIRD) measurement correlation to back end wafer backside finishing

by Ng Chee Yang
Published in 36th International Electronics Manufacturing Technology Conference (01.11.2014)

Get full text

Conference Proceeding

Method of Forming a Chip Package, Method of Forming a Semiconductor Arrangement, Chip Package, and Semiconductor Arrangement

Method of Forming a Chip Package, Method of Forming a Semiconductor Arrangement, Chip Package, and Semiconductor Arrangement

by Ng, Chee Yang
Year of Publication 05.05.2022

Get full text

Patent

Semiconductor package having a chip carrier and a metal plate sized independently of the chip carrier

Semiconductor package having a chip carrier and a metal plate sized independently of the chip carrier

by Ng, Chee Yang, Woetzel, Stefan
Year of Publication 13.06.2023

Get full text

Patent

Hybrid Embedded Package

Hybrid Embedded Package

by Ng, Chee Yang, Woetzel, Stefan
Year of Publication 16.02.2023

Get full text

Patent

Hybrid embedded package

Hybrid embedded package

by Ng, Chee Yang, Woetzel, Stefan
Year of Publication 06.12.2022

Get full text

Patent

Hybrid Embedded Package

Hybrid Embedded Package

by Ng, Chee Yang, Woetzel, Stefan
Year of Publication 14.04.2022

Get full text

Patent

SEMICONDUCTOR PACKAGE HAVING A CHIP CARRIER AND A METAL PLATE SIZED INDEPENDENTLY OF THE CHIP CARRIER

SEMICONDUCTOR PACKAGE HAVING A CHIP CARRIER AND A METAL PLATE SIZED INDEPENDENTLY OF THE CHIP CARRIER

by Ng, Chee Yang, Woetzel, Stefan
Year of Publication 31.03.2022

Get full text

Patent

Semiconductor package with air gap

Semiconductor package with air gap

by Ng, Chee Yang
Year of Publication 05.03.2019

Get full text

Patent

Halbleiterpackage mit Luftspalt und Verfahren zu dessen Herstellung

Halbleiterpackage mit Luftspalt und Verfahren zu dessen Herstellung

by Ng, Chee Yang
Year of Publication 07.12.2023

Get full text

Patent

Semiconductor chip with electrically conducting layer

Semiconductor chip with electrically conducting layer

by Ng, Chee Yang
Year of Publication 23.10.2018

Get full text

Patent

Package with acoustic sensing device(s) and millimeter wave sensing elements

Package with acoustic sensing device(s) and millimeter wave sensing elements

by Ng, Chee Yang, Chua, Kok Yau
Year of Publication 15.06.2021

Get full text

Patent

EIN HALBLEITERBAUELEMENT UND EIN VERFAHREN ZUM BILDEN EINES HALBLEITERBAUELEMENTS

EIN HALBLEITERBAUELEMENT UND EIN VERFAHREN ZUM BILDEN EINES HALBLEITERBAUELEMENTS

by Ng, Chee Yang
Year of Publication 25.08.2022

Get full text

Patent

VERFAHREN ZUM HERSTELLEN EINES CHIPPACKAGES, VERFAHREN ZUM HERSTELLEN EINER HALBLEITERANORDNUNG, CHIPPACKAGE UND HALBLEITERANORDNUNG

VERFAHREN ZUM HERSTELLEN EINES CHIPPACKAGES, VERFAHREN ZUM HERSTELLEN EINER HALBLEITERANORDNUNG, CHIPPACKAGE UND HALBLEITERANORDNUNG

by Ng, Chee Yang
Year of Publication 05.05.2022

Get full text

Patent

Semiconductor device and a method for forming a semiconductor device

Semiconductor device and a method for forming a semiconductor device

by Ng Chee Yang
Year of Publication 18.04.2017

Get full text

Patent

VOLTAGE REGULATOR MODULE WITH INDUCTOR-COOLED POWER STAGE

VOLTAGE REGULATOR MODULE WITH INDUCTOR-COOLED POWER STAGE

by Ng, Chee Yang, Deboy, Gerald, Kessler, Angela, Chua, Kok Yau, Leong, Kennith Kin, Peluso, Luca
Year of Publication 16.11.2023

Get full text

Patent

Stacked transistor chip package with source coupling

Stacked transistor chip package with source coupling

by Yuferev, Sergey, Ng, Chee Yang, Palm, Petteri, Long, Theng Chao, Calo, Paul Armand Asentista, Maerz, Josef, Yong, Wae Chet
Year of Publication 17.09.2024

Get full text

Patent

PACKAGE WITH ACOUSTIC SENSING DEVICE(S) AND MILLIMETER WAVE SENSING ELEMENTS

PACKAGE WITH ACOUSTIC SENSING DEVICE(S) AND MILLIMETER WAVE SENSING ELEMENTS

by Ng, Chee Yang, Chua, Kok Yau
Year of Publication 14.05.2020

Get full text

Patent

PACKAGE FOR A LATERAL POWER TRANSISTOR

PACKAGE FOR A LATERAL POWER TRANSISTOR

by Jones, Edward Andrew, Ng, Chee Yang, Tee, Guan Choon Matthew Nelson, Schiess, Klaus, Chua, Kok Yau, Mostofizadeh, Milad
Year of Publication 16.05.2024

Get full text

Patent

Semiconductor package having a chip carrier with a pad offset feature

Semiconductor package having a chip carrier with a pad offset feature

by Lee, Chee Hong, Ng, Chee Yang, Narayanasamy, Jayaganasan, Woetzel, Stefan, Fuergut, Edward, Gan, Thai Kee, Otremba, Ralf
Year of Publication 14.05.2024

Get full text

Patent

1
2
3
4
5
6
7
8
9
Next
[9]