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Molded Semiconductor Package
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Year of Publication 02.01.2020
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Molded semiconductor package having an optical inspection feature
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Year of Publication 01.10.2019
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Semiconductor package and method for fabricating a semiconductor package
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Year of Publication 26.11.2019
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Molded Semiconductor Package Having an Optical Inspection Feature
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Year of Publication 01.02.2018
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Mold-Gehäusestruktur mit Klebstoff-Auslaufstopper zum Abdichten eines MEMS-Bauelements und Verfahren zum Verpacken eines MEMS-Bauelements
Ng, Mei Chin, Lee, Swee Kah, Steiert, Matthias, Chiang, Chau Fatt, Martens, Stefan, Chua, Kok Yau, Chua, Hock Siang, Chan, Sook Woon, Yeo, Kian Hong
Year of Publication 21.04.2022
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Year of Publication 21.04.2022
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Molded package structure with glue bleed stopper for sealing a MEMs device method of packaging a MEMs device
Chua Kok Yau, Steiert Matthias, Martens Stefan, Yeo Kian Hong, Chan Sook Woon, Lee Swee Kah, Ng Mei Chin, Chiang Chau Fatt, Chua Hock Siang
Year of Publication 25.10.2016
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Year of Publication 25.10.2016
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Verfahren zum Herstellen von gemoldeten Halbleiterpackungen aufweisend ein optisches Inspektionsmerkmal und gemoldete Halbleiterpackung
Chong, Hock Heng, Ng, Mei Chin, Lee, Swee Kah, Lum, Fong Mei, Sanusi, Muhammad Muhammat, Soriano, Aileen, Goh, Soon Lock
Year of Publication 02.07.2020
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Year of Publication 02.07.2020
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HALBLEITER-PACKAGE UND VERFAHREN ZUM FERTIGEN EINES HALBLEITER-PACKAGE
Chong, Hock Heng, Ng, Mei Chin, Pok, Pei Luan, Fang, Chee Hong, Ng, Yean Seng, Chiang, Chau Fatt, Muhammad, Muhammat Sanusi, Chung, Khar Foong, Wang, Choon Huey, Chan, Sook Woon
Year of Publication 14.06.2018
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Year of Publication 14.06.2018
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