A novel analytical filling time chart for design optimization of flip-chip underfill encapsulation process
Ng, Fei Chong, Ali, M. Yusuf Tura, Abas, Aizat, Khor, C. Y., Samsudin, Z., Abdullah, M. Z.
Published in International journal of advanced manufacturing technology (01.12.2019)
Published in International journal of advanced manufacturing technology (01.12.2019)
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Journal Article
Spatial analysis of underfill flow in flip-chip encapsulation
Ng, Fei Chong, Zawawi, Mohd Hafiz, Abas, Mohamad Aizat
Published in Soldering & surface mount technology (15.03.2021)
Published in Soldering & surface mount technology (15.03.2021)
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Journal Article
Filling efficiency of flip-chip underfill encapsulation process
Ng, Fei Chong, Abas, Mohamad Aizat, Abdullah, Mohd Zulkifly
Published in Soldering & surface mount technology (17.01.2020)
Published in Soldering & surface mount technology (17.01.2020)
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Journal Article
Symmetrical Unit-Cell Numerical Approach for Flip-Chip Underfill Flow Simulation
Fei Chong, Ng, Zawawi, Mohd Hafiz, Lun Hao, Tung, Abas, Mohamad Aizat, Abdullah, Mohd Zulkifly
Published in CFD letters (30.08.2020)
Published in CFD letters (30.08.2020)
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Journal Article
CUF scaling effect on contact angle and threshold pressure
Ng, Fei Chong, Abas, Mohamad Aizat, Abdullah, MZ, Ishak, MHH, Chong, Gean Yuen
Published in Soldering & surface mount technology (04.09.2017)
Published in Soldering & surface mount technology (04.09.2017)
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Journal Article
Effect of different temperature distribution on multi-stack BGA package
Tung, Lun Hao, Ng, Fei Chong, Abas, Aizat, Abdullah, M.Z, Samsudin, Zambri, Tura Ali, Mohd Yusuf
Published in Microelectronics international (17.08.2021)
Published in Microelectronics international (17.08.2021)
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Journal Article
Effect of Barrier Height on the Design of Stepped Spillway Using Smoothed Particle Hydrodynamics and Particle Image Velocimetry
Azman, Aqil, Ng, Fei Chong, Zawawi, Mohd. Hafiz, Abas, Aizat, Rozainy M. A. Z., Mohd. Remy, Abustan, Ismail, Adlan, Mohd. Nordin, Tam, Wei Loon
Published in KSCE journal of civil engineering (01.02.2020)
Published in KSCE journal of civil engineering (01.02.2020)
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Journal Article
Performance Evaluation of Composite Cross-Arm Structure Under Different Magnitude of Loading
Mohamad, Daud, Beddu, Salmia, Syamsir, Agusril, Zahari, Nazirul Mubin, Abu Seman, Sareh Aiman Hilmi, Razali, Muhammad Fauzinizam, Abas, Aizat, Ng, Fei Chong
Published in IOP conference series. Materials Science and Engineering (01.09.2020)
Published in IOP conference series. Materials Science and Engineering (01.09.2020)
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Journal Article
Failure analysis of various fiberglass cross-arm designs under multi-axial loading
Mohamad, Daud, Beddu, Salmia, Syamsir, Agusril, Zahari, Nazirul Mubin, Razali, Muhammad Fauzinizam, Abu Seman, Sareh Aiman Hilmi, Abas, Aizat, Ng, Fei Chong
Published in IOP conference series. Materials Science and Engineering (01.09.2020)
Published in IOP conference series. Materials Science and Engineering (01.09.2020)
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Journal Article
Fluid/structure interaction study on the variation of radial gate's gap height in dam
Ng, Fei Chong, Abas, Aizat, Abustan, Ismail, Rozainy, Z. Mohd Remy, Abdullah, MZ, Jamaludin, Ali b., Kon, Sharon Melissa
Published in IOP conference series. Materials Science and Engineering (01.05.2018)
Published in IOP conference series. Materials Science and Engineering (01.05.2018)
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Journal Article
Effect of the gap height of radial gate on the volumetric flow rate in dam
Ng, Fei Chong, Abas, Aizat, Abustan, Ismail, Rozainy, Z. Mohd Remy, Abdullah, MZ, Jamaludin, Ali b., Kon, Sharon Melissa
Published in IOP conference series. Materials Science and Engineering (01.05.2018)
Published in IOP conference series. Materials Science and Engineering (01.05.2018)
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Journal Article
Visualization of Underfill Flow in Ball Grid Array (BGA) using Particle Image Velocimetry (PIV)
Ng, Fei Chong, Abas, Aizat, Abustan, Ismail, Rozainy, Z. Mohd Remy, Abdullah, MZ, Jamaludin, Ali b., Kon, Sharon Melissa
Published in IOP conference series. Materials Science and Engineering (01.05.2018)
Published in IOP conference series. Materials Science and Engineering (01.05.2018)
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Journal Article
Scaling Effect on Velocity Profiles in Capillary Underfill Flow
Ng, Fei Chong, Abas, Aizat, Abdullah, M Z, Ishak, M H H, Chong, Gean Yuen
Published in IOP conference series. Materials Science and Engineering (01.06.2017)
Published in IOP conference series. Materials Science and Engineering (01.06.2017)
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Journal Article
Effect of scale size, orientation type and dispensing method on void formation in the CUF encapsulation of BGA
ABAS, AIZAT, NG, FEI CHONG, GAN, Z L, ISHAK, M H H, ABDULLAH, M Z, CHONG, GEAN YUEN
Published in Sadhana (Bangalore) (01.04.2018)
Published in Sadhana (Bangalore) (01.04.2018)
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Journal Article
Prediction of the void formation in no-flow underfill process using machine learning-based algorithm
Nashrudin, Muhammad Naqib, Ng, Fei Chong, Abas, Aizat, Abdullah, Mohd. Zulkifly, Ali, Mohd. Yusuf Tura, Samsudin, Zambri
Published in Microelectronics and reliability (01.08.2022)
Published in Microelectronics and reliability (01.08.2022)
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Journal Article