Effect of underfill on electromigration lifetime in flip chip joints
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Published in Journal of alloys and compounds (29.07.2009)
Published in Journal of alloys and compounds (29.07.2009)
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Journal Article
Effective Thermal Conductivity of Isotropic Formed Green Carbon during Carbonization Process
Fukai, Jun, Orita, Hisayuki, Nejime, Takayuki, Saruwatari, Kazutaka, Miyatake, Osamu
Published in KAGAKU KOGAKU RONBUNSHU (01.01.1993)
Published in KAGAKU KOGAKU RONBUNSHU (01.01.1993)
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Journal Article
Effect of solders, underfills and substrates on the reliability of flip-chip bonding of low-k semiconductor chips
Terada, K, Nejime, T, Ooyoshi, T, Kobayashi, K, Yamanaka, K
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Published in 2010 IEEE CPMT Symposium Japan (01.08.2010)
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