Advanced thick film system for AlN substrates
Wang, Y.L, Carroll, A.F, Smith, J.D, Cho, Y, Bacher, R.J, Anderson, D.K, Crumpton, J.C, Needes, C.R.S
Published in Microelectronics international (01.04.2003)
Published in Microelectronics international (01.04.2003)
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Journal Article
Smart materials for hybrid circuit and multi chip module
Horowitz, S.J., Needes, C.R.S.
Published in Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium (1995)
Published in Proceedings of 1995 Japan International Electronic Manufacturing Technology Symposium (1995)
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Conference Proceeding
The thermal-cycled adhesion of thick-film copper conductors
Needes, C.R.S., Knaak, J.F.
Published in 38th Electronics Components Conference 1988., Proceedings (1988)
Published in 38th Electronics Components Conference 1988., Proceedings (1988)
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Conference Proceeding
Next-generation, Advanced Thick Film Multilayer System
LaBranche, M.H., McCormick, C.J., Smith, J.D., Keusseyan, R.L., Mason, R.C., Fahey, M.A., Needes, C.R.S.
Published in IEMT/IMC Symposium, 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference] (1997)
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Published in IEMT/IMC Symposium, 1st [Joint International Electronic Manufacturing Symposium and the International Microelectronics Conference] (1997)
Conference Proceeding
High conductivity materials systems for advanced hybrids
Borland, W., Needes, C.R.S., Siuta, V.P., Nair, K.M.
Published in Proceedings., 39th Electronic Components Conference (1989)
Published in Proceedings., 39th Electronic Components Conference (1989)
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Conference Proceeding
Via formation in green ceramic dielectrics using a YAG laser
D'Ambra, D.M., Needes, M.C.A., Needes, C.R.S., Wang, C.B.
Published in 1992 Proceedings 42nd Electronic Components & Technology Conference (1992)
Published in 1992 Proceedings 42nd Electronic Components & Technology Conference (1992)
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Conference Proceeding