by Ndip, I, Huhn, M, Brandenburger, F, Ehrhardt, C, Schneider-Ramelow, M, Reichl, H, Lang, K.D, Henke, H
Published in Electronics letters (06.07.2017)

by NDIP, I, ÖZ, A, TSCHOBAN, C, GUTTOWSKI, S, REICHL, H, LANG, K.-D, HENKE, H
Published in IET microwaves, antennas & propagation (17.07.2012)

by Kleinholz, C., Muller, B., Fischer, M., Tschoban, C., Koszegi, J.-M., Potter, H., Ndip, I., Schneider-Ramelow, M., Muller, J.
Published in 2024 International Conference on Electronics Packaging (ICEP) (17.04.2024)

by Tschoban, C., Schwanitz, O., Le, T.H., Thomas, T., Becker, K.F., Braun, T., Ndip, I., Potter, H., Schneider-Ramelow, M.
Published in 2022 IEEE 24th Electronics Packaging Technology Conference (EPTC) (07.12.2022)

by Braun, T., Topper, M., Becker, K.-F, Wilke, M., Huhn, M., Maass, U., Ndip, I., Aschenbrenner, R., Lang, K.-D
Published in 2016 IEEE 16th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (SiRF) (01.01.2016)

by Curran, B, Ndip, I, Guttowski, S, Reichl, H
Published in IEEE transactions on microwave theory and techniques (01.09.2010)

by Ndip, I., Curran, B., Lobbicke, K., Guttowski, S., Reichl, H., Lang, K.-D, Henke, H.
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.10.2011)

by Schröder, H, Brusberg, L, Erxleben, R, Ndip, I, Töpper, M, Nissen, N F, Reichl, H
Published in 2010 Proceedings 60th Electronic Components and Technology Conference (ECTC) (01.06.2010)

by Lang, K.-D, Ndip, I., Guttowksi, S.
Published in 2013 IEEE 13th Topical Meeting on Silicon Monolithic Integrated Circuits in RF Systems (01.01.2013)

by Gieser, H A, Bonfert, D, Hengelmann, H, Wolf, H, Bock, K, Zollmer, V, Werner, C, Domann, G, Bahr, J, Ndip, I, Curran, B, Oehler, F, Milosiu, H
Published in 3rd Electronics System Integration Technology Conference ESTC (01.09.2010)

by Ohnimus, F., Fotheringham, G., Ndip, I., Engin, A. E., Guttowski, S., Reichl, H., Lang, K.-D
Published in IEEE transactions on electromagnetic compatibility (01.11.2011)

by Ndip, I., Guttowski, S., Reichl, H.
Published in 2009 IEEE International Symposium on Electromagnetic Compatibility (01.08.2009)

by Curran, B., Ndip, I., Guttowski, S., Reichl, H.
Published in 2009 IEEE International Symposium on Electromagnetic Compatibility (01.08.2009)

by Braun, T., Becker, K.-F., Hoelck, O., Kahle, R., Woehrmann, M., Toepper, M., Ndip, I., Maass, U., Tschoban, C., Aschenbrenner, R., Voges, S., Lang, K.-D.
Published in 2018 International Conference on Electronics Packaging and iMAPS All Asia Conference (ICEP-IAAC) (01.04.2018)

by Ndip, I., Guttowski, S., Reichl, H.
Published in 2007 IEEE International Symposium on Electromagnetic Compatibility (01.07.2007)

by Ndip, I, Löbbicke, Kai, Tschoban, C, Töpper, Michael, Guttowski, S, Reichl, H, Lang, K
Published in 2010 IEEE International Symposium on Electromagnetic Compatibility (01.07.2010)

by Ebberg, Alfred, Meggers, Jürgen, Rathjen, Kai, Fotheringham, Gerhard, Ndip, Ivan, Ohnimus, Florian, Tschoban, Christian, Pieper, Isa, Kilian, Andreas, Methfessel, Sebastian, Letz, Martin, Fotheringham, Ulrich
Published in Advances in Multifunctional Materials and Systems II (01.01.2014)

by Ndip, I, Schneider-Ramelow, M, Huhn, M, Brandenburger, F, Hempel, M, Lang, KD
Published in IET Conference Proceedings (09.04.2018)

by Ndip, I., Guttowski, S., Reichl, H., Lang, K.
Published in 2012 IEEE Electrical Design of Advanced Packaging and Systems Symposium (EDAPS) (01.12.2012)

by Ndip, I., Curran, B., Guttowski, S., Reichl, H.
Published in 2009 European Microelectronics and Packaging Conference (01.06.2009)