by Ranganathan, N., Ebin, L., Linn, L., Lee, W.S.V., Navas, O.K., Kripesh, V., Balasubramanian, N.
Published in IEEE transactions on advanced packaging (01.02.2009)

by Hyoung Joon Kim, Ser Choong Chong, Ho, D. S. W., Yong, E. W. Y., Chee Houe Khong, Teo, C. W. L., Fernandez, D. M., Guan Kian Lau, Vasarla, N. S., Lee, V. W. S., Vempati, S. R., Navas, K. O. K.
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)

by Zhang, H.Y., Pinjala, D., Navas, O.K., Iyer, M.K., Chan, P.K., Liu, X.P., Hayashi, H., Han, J.B.
Published in ITherm 2002. Eighth Intersociety Conference on Thermal and Thermomechanical Phenomena in Electronic Systems (Cat. No.02CH37258) (2002)

by Chen, X.Y., Toh, K.C., Wong, T.N., Chai, J.C., Pinjala, D., Navas, O.K., Ganesh, Hengyun Zhang, Kripesh, V.
Published in The Ninth Intersociety Conference on Thermal and Thermomechanical Phenomena In Electronic Systems (IEEE Cat. No.04CH37543) (2004)

by Ranganathan, N., Liao Ebin, Linn Linn, Lee, W.S.V., Navas, O.K., Kripesh, V., Balasubramanian, N.
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)

by Tan, S.P., Toh, K.C., Chai, J.C., Pinjala, D., Khan, O.K.N.
Published in 2007 9th Electronics Packaging Technology Conference (01.12.2007)

by Chai, T.C., Xiaowu Zhang, Li, H.Y., Sekhar, V.N., Hnin, W.Y., Thew, M.L., Navas, O.K., Lau, J., Murthy, R., Balakumar, S., Tan, Y.M., Cheng, C.K., Liew, S.L., Chi, D.Z., Zhu, W.H.
Published in 2008 58th Electronic Components and Technology Conference (01.05.2008)

by Chen, X.Y., Toh, K.C., Chai, J.C., Wong, T.N., Pinjala, D., Navas, O.K., Ganesh, Hengyun Zhang, Kripesh, V.
Published in Proceedings of the 5th Electronics Packaging Technology Conference (EPTC 2003) (2003)

by Ling Xie, Pinjala, D., Sudharsanam, K., Pamidighantam, R., Navas, K.O.K., Jingbo Zhang, Wanxun He, Baoxi Xu
Published in 2004 Proceedings. 54th Electronic Components and Technology Conference (IEEE Cat. No.04CH37546) (2004)