by Xing‑Quan Liu(Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Nano Science and Technology Institute, University of Science and Technology of China), Zhe Li, Zhen‑Jia Peng(Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, College of Materials Sciences and Engineering, Shenzhen University), Rui‑Xun Wang(Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Zhi‑Quan Liu(Shenzhen Institute of Advanced Electronic Materials, Shenzhen Institute of Advanced Technology, Chinese Academy of Sciences, Shenzhen College of Advanced Technology, University of Chinese Academy of Sciences)
Published in Metals and materials international (01.01.2024)