The mechanical effect of soft pad on copper chemical mechanical polishing
Liu, Pengzhan, Nam, Yuna, Lee, Seunghwan, Kim, Eungchul, Jeon, Sanghuck, Park, Kihong, Hong, Seokjun, Kim, Taesung
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Published in Materials science in semiconductor processing (01.03.2023)
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Environmentally friendly buff cleaning of ceria nanoparticles using bubbles in gas-dissolved water
Liu, Pengzhan, Nam, Yuna, Jeon, Sanghuck, Kim, Changmin, Kim, Eungchul, Choi, Sanghwan, Lee, Seungjae, Park, Sang-Hyeon, Hong, Seokjun, Kim, Taesung
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Published in Colloids and surfaces. A, Physicochemical and engineering aspects (20.08.2023)
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