Development of lead-free Sn-3.5Ag/SnO2 nanocomposite solders
Babaghorbani, P., Nai, S. M. L., Gupta, M.
Published in Journal of materials science. Materials in electronics (01.06.2009)
Published in Journal of materials science. Materials in electronics (01.06.2009)
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Journal Article
Development of a Sn–Ag–Cu solder reinforced with Ni-coated carbon nanotubes
Han, Y. D., Nai, S. M. L., Jing, H. Y., Xu, L. Y., Tan, C. M., Wei, J.
Published in Journal of materials science. Materials in electronics (01.03.2011)
Published in Journal of materials science. Materials in electronics (01.03.2011)
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Journal Article
Selective laser melting enabling the hierarchically heterogeneous microstructure and excellent mechanical properties in an interstitial solute strengthened high entropy alloy
Zhu, Z. G., An, X. H., Lu, W. J., Li, Z. M., Ng, F. L., Liao, X. Z., Ramamurty, U., Nai, S. M. L., Wei, J.
Published in Materials research letters (02.11.2019)
Published in Materials research letters (02.11.2019)
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Journal Article
Temperature Dependence of Creep and Hardness of Sn-Ag-Cu Lead-Free Solder
Han, Y.D., Jing, H.Y., Nai, S.M.L., Xu, L.Y., Tan, C.M., Wei, J.
Published in Journal of electronic materials (01.02.2010)
Published in Journal of electronic materials (01.02.2010)
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Journal Article
Creep mitigation in Sn–Ag–Cu composite solder with Ni-coated carbon nanotubes
Han, Y. D., Jing, H. Y., Nai, S. M. L., Xu, L. Y., Tan, C. M., Wei, J.
Published in Journal of materials science. Materials in electronics (01.05.2012)
Published in Journal of materials science. Materials in electronics (01.05.2012)
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Journal Article
Effect of Ni-Coated Carbon Nanotubes on the Corrosion Behavior of Sn-Ag-Cu Solder
Han, Y. D., Chen, L., Jing, H. Y., Nai, S. M. L., Wei, J., Xu, L.Y.
Published in Journal of electronic materials (01.12.2013)
Published in Journal of electronic materials (01.12.2013)
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Journal Article
Effect of Ni-Coated Carbon Nanotubes on Interfacial Reaction and Shear Strength of Sn-Ag-Cu Solder Joints
Han, Y. D., Jing, H. Y., Nai, S. M. L., Xu, L. Y., Tan, C. M., Wei, J.
Published in Journal of electronic materials (01.09.2012)
Published in Journal of electronic materials (01.09.2012)
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Journal Article
A modified constitutive model for creep of Sn–3.5Ag–0.7Cu solder joints
Han, Y D, Jing, H Y, Nai, S M L, Tan, C M, Wei, J, Xu, L Y, Zhang, S R
Published in Journal of physics. D, Applied physics (21.06.2009)
Published in Journal of physics. D, Applied physics (21.06.2009)
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Journal Article
Effect of Amount of Cu on the Intermetallic Layer Thickness Between Sn-Cu Solders and Cu Substrates
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Journal Article
Conference Proceeding
The role of powder layer thickness on the quality of SLM printed parts
Nguyen, Q. B., Luu, D. N., Nai, S. M. L., Zhu, Z., Chen, Z., Wei, J.
Published in Archives of Civil and Mechanical Engineering (01.07.2018)
Published in Archives of Civil and Mechanical Engineering (01.07.2018)
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Journal Article
Texture evolution in a CrMnFeCoNi high-entropy alloy manufactured by laser powder bed fusion
He, X. Y., Wang, H., Zhu, Z. G., Wang, L. Z., Liu, J. Q., Haghdadi, N., Nai, S. M. L., Huang, J., Primig, S., Ringer, S. P., Liao, X. Z.
Published in Journal of materials science (01.06.2022)
Published in Journal of materials science (01.06.2022)
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Journal Article
Development of WC-Inconel composites using selective laser melting
Nguyen, Q. B., Zhu, Z., Chua, B. W., Zhou, W., Wei, J., Nai, S. M. L.
Published in Archives of Civil and Mechanical Engineering (01.09.2018)
Published in Archives of Civil and Mechanical Engineering (01.09.2018)
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Journal Article
Influence of ceramic reinforcements on the wettability and mechanical properties of novel lead-free solder composites
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Journal Article
Conference Proceeding