A Novel Approach to Photonic Packaging Leveraging Existing High-Throughput Microelectronic Facilities
Barwicz, Tymon, Taira, Yoichi, Lichoulas, Ted W., Boyer, Nicolas, Martin, Yves, Numata, Hidetoshi, Jae-Woong Nah, Takenobu, Shotaro, Janta-Polczynski, Alexander, Kimbrell, Eddie L., Leidy, Robert, Khater, Marwan H., Kamlapurkar, Swetha, Engelmann, Sebastian, Vlasov, Yurii A., Fortier, Paul
Published in IEEE journal of selected topics in quantum electronics (01.11.2016)
Published in IEEE journal of selected topics in quantum electronics (01.11.2016)
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Journal Article
Three-Dimensional a-Si:H Solar Cells on Glass Nanocone Arrays Patterned by Self-Assembled Sn Nanospheres
Kim, Jeehwan, Hong, Augustin J, Nah, Jae-Woong, Shin, Byungha, Ross, Frances M, Sadana, Devendra K
Published in ACS nano (24.01.2012)
Published in ACS nano (24.01.2012)
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Journal Article
Fabrication and Performance of 300 mm Wafer Scale Silicon Microchannel Cooler
Colgan, Evan G., Schleupen, Kai, Mann, Phillip, Kuder, Robert, Nah, Jae-Woong, Sakuma, Katsuyuki, Alvarez, Victor, Turlapati, Lavanya, Wong, Danny, Lukashov, Stanislav, Cordes, Steve, Speidell, James
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2023)
Published in IEEE transactions on components, packaging, and manufacturing technology (2011) (01.04.2023)
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Journal Article
An 82%-efficient multiphase voltage-regulator 3D interposer with on-chip magnetic inductors
Tien, Kevin, Sturcken, Noah, Naigang Wang, Jae-woong Nah, Bing Dang, O'Sullivan, Eugene, Andry, Paul, Petracca, Michele, Carloni, Luca P., Gallagher, William, Shepard, Kenneth
Published in 2015 Symposium on VLSI Technology (VLSI Technology) (01.06.2015)
Published in 2015 Symposium on VLSI Technology (VLSI Technology) (01.06.2015)
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Conference Proceeding
Journal Article
Electromigration in flip chip solder bump of 97Pb–3Sn/37Pb–63Sn combination structure
Nah, Jae-Woong, Kim, Jong Hoon, Lee, Hyuck Mo, Paik, Kyung-Wook
Published in Acta materialia (01.01.2004)
Published in Acta materialia (01.01.2004)
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Journal Article
Effect of electromigration on mechanical shear behavior of flip chip solder joints
Nah, Jae-Woong, Ren, Fei, Paik, Kyung-Wook, Tu, K.N.
Published in Journal of materials research (01.03.2006)
Published in Journal of materials research (01.03.2006)
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Journal Article
Automated, high-throughput photonic packaging
Barwicz, Tymon, Lichoulas, Ted W., Taira, Yoichi, Martin, Yves, Takenobu, Shotaro, Janta-Polczynski, Alexander, Numata, Hidetoshi, Kimbrell, Eddie L., Nah, Jae-Woong, Peng, Bo, Childers, Darrell, Leidy, Robert, Khater, Marwan, Kamlapurkar, Swetha, Cyr, Elaine, Engelmann, Sebastian, Fortier, Paul, Boyer, Nicolas
Published in Optical fiber technology (01.08.2018)
Published in Optical fiber technology (01.08.2018)
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Journal Article
Formation of Pb/63Sn solder bumps using a solder droplet jetting method
SON, Ho-Young, NAH, Jae-Woong, PAIK, Kyung-Wook
Published in IEEE transactions on electronics packaging manufacturing (01.07.2005)
Published in IEEE transactions on electronics packaging manufacturing (01.07.2005)
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Journal Article
Application of electronic speckle-pattern interferometry to measure in-plane thermal displacement in flip-chip packages
Lee, Baik-Woo, Jang, Woosoon, Kim, Dong-Won, Jeong, Jeung-hyun, Nah, Jae-Woong, Paik, Kyung-Wook, Kwon, Dongil
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (25.08.2004)
Published in Materials science & engineering. A, Structural materials : properties, microstructure and processing (25.08.2004)
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Journal Article
Flip chip assembly with sub-micron 3D re-alignment via solder surface tension
Jae-Woong Nah, Martin, Yves, Kamlapurkar, Swetha, Engelmann, Sebastian, Bruce, Robert L., Barwicz, Tymon
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
Published in 2015 IEEE 65th Electronic Components and Technology Conference (ECTC) (01.05.2015)
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Conference Proceeding
Toward High-Yield 3D Self-Alignment of Flip-Chip Assemblies via Solder Surface Tension
Martin, Yves, Jae-Woong Nah, Kamlapurkar, Swetha, Engelmann, Sebastian, Barwicz, Tymon
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding
Solder Mobility for High-Yield Self-Aligned Flip-Chip Assembly
Martin, Yves, Kamlapurkar, Swetha, Jae-Woong Nah, Marchack, Nathan, Barwicz, Tymon
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
High-Speed Precision Handling Technology of Micro-Chip for Fan-Out Wafer Level Packaging (FOWLP) Application
Qianwen Chen, Li-wen Hung, Colgan, Evan, Bo Wen, Bing Dang, Budd, Russell, Jae-woong Nah, Knickerbocker, John
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
Published in 2018 IEEE 68th Electronic Components and Technology Conference (ECTC) (01.05.2018)
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Conference Proceeding
Investigation of flip chip under bump metallization systems of Cu pads
Nah, Jae-Woong, Paik, Kyung-Wook
Published in IEEE transactions on components and packaging technologies (01.03.2002)
Published in IEEE transactions on components and packaging technologies (01.03.2002)
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Journal Article
Wafer IMS (Injection molded solder) - A new fine pitch solder bumping technology on wafers with solder alloy composition flexibility
Jae-Woong Nah, Gelorme, Jeffrey, Sorce, Peter, Lauro, Paul, Perfecto, Eric, McLeod, Mark, Toriyama, Kazushige, Orii, Yasumitsu, Brofman, Peter, Nauchi, Takashi, Takaguchi, Akira, Ishiguro, Kazuya, Yoshikawa, Tomoyasu, Daily, Derek, Suzuki, Ryoichi
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
Published in 2014 IEEE 64th Electronic Components and Technology Conference (ECTC) (01.05.2014)
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Conference Proceeding
Integration and Packaging of Embedded Radial Micro-Channels for 3D Chip Cooling
Bing Dang, Colgan, Evan, Fanghao Yang, Schultz, Mark, Yang Liu, Qianwen Chen, Jae-Woong Nah, Polastre, Robert, Gaynes, Michael, McVicker, Gerard, Parida, Pritish, Tsang, Cornelia, Knickerbocker, John, Chainer, Timothy
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding
High-throughput photonic packaging
Barwicz, Tymon, Lichoulas, Ted W., Taira, Yoichi, Martin, Yves, Takenobu, Shotaro, Janta-Polczynski, Alexander, Numata, Hidetoshi, Kimbrell, Eddie L., Jae-Woong Nah, Bo Peng, Leidy, Robert, Khater, Marwan, Kamlapurkar, Swetha, Engelmann, Sebastian, Fortier, Paul, Boyer, Nicolas
Published in 2017 Optical Fiber Communications Conference and Exhibition (OFC) (01.03.2017)
Published in 2017 Optical Fiber Communications Conference and Exhibition (OFC) (01.03.2017)
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Conference Proceeding
Development of wafer level underfill materials and assembly processes for fine pitch Pb-free solder flip chip packaging
Jae-Woong Nah, Gaynes, M. A., Feger, C., Katsurayama, S., Suzuki, H.
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
Published in 2011 IEEE 61st Electronic Components and Technology Conference (ECTC) (01.05.2011)
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Conference Proceeding
Enabling large-scale deployment of photonics through cost-efficient and scalable packaging
Barwicz, Tymon, Taira, Yoichi, Lichoulas, Ted W., Boyer, Nicolas, Numata, Hidetoshi, Martin, Yves, Jae-Woong Nah, Takenobu, Shotaro, Janta-Polczynski, Alexander, Kimbrell, Eddie L., Leidy, Robert, Khater, Marwan, Kamlapurkar, Swetha, Engelmann, Sebastian, Vlasov, Yurii A., Fortier, Paul
Published in 2015 IEEE 12th International Conference on Group IV Photonics (GFP) (01.08.2015)
Published in 2015 IEEE 12th International Conference on Group IV Photonics (GFP) (01.08.2015)
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Conference Proceeding