Reliability Challenges in 2.5D and 3D IC Integration
Li Li, Ton, Paul, Nagar, Mohan, Chia, Pierre
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
Published in 2017 IEEE 67th Electronic Components and Technology Conference (ECTC) (01.05.2017)
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Conference Proceeding
3D SiP with Organic Interposer for ASIC and Memory Integration
Li Li, Chia, Pierre, Ton, Paul, Nagar, Mohan, Patil, Sada, Jie Xue, Delacruz, Javier, Voicu, Marius, Hellings, Jack, Isaacson, Bill, Coor, Mark, Havens, Ross
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
Published in 2016 IEEE 66th Electronic Components and Technology Conference (ECTC) (01.05.2016)
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Conference Proceeding
Is high bone mass index protective for osteoporosis? ‘Evaluation of relationship between body mass index, and bone mineral density in the population of the Himalayan region of India
Sharma, Pankaj, Nagar, Madan Mohan, Shukla, Jyoti, Lal, Yash Mohan, Singh, Navdeep, Gupta, Sourabh, Gupta, Puneet
Published in International Journal of Orthopaedics Sciences (01.10.2017)
Published in International Journal of Orthopaedics Sciences (01.10.2017)
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Journal Article
FRAX predictior with and without BMD for assessment of osteoporotic fracture risk in the Himalayan state of India: A comparative study
Sharma, Pankaj, Nagar, Madan Mohan, Shukla, Jyoti, Dingra, Mohit, Badoni, Navneet, Gupta, Puneet
Published in International Journal of Orthopaedics Sciences (01.10.2017)
Published in International Journal of Orthopaedics Sciences (01.10.2017)
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Journal Article
Intra-articular platelet rich plasma in osteoarthritis knee
Rawat, Dr. Pawan Kumar, Agarwal, Dr. Rahul, Ahuja, Dr. Yogesh, Nagar, Dr. Madan Mohan, Kothiyal, Dr. Pranav, VIJ, Dr. Kunal, Gupta, Dr. Puneet
Published in International Journal of Orthopaedics Sciences (01.10.2021)
Published in International Journal of Orthopaedics Sciences (01.10.2021)
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Journal Article
METHOD AND APPARATUS FOR SUPPORTING A COMPUTER CHIP ON A PRINTED CIRCUIT BOARD ASSEMBLY
NAGAR MOHAN R, AHMAD MUDASIR, SHANKER BANGALORE J, XUE JIE, LIU KUOUAN
Year of Publication 18.06.2015
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Year of Publication 18.06.2015
Patent
Method and apparatus for supporting a computer chip on a printed circuit board assembly
NAGAR MOHAN R, AHMAD MUDASIR, SHANKER BANGALORE J, XUE JIE, LIU KUOUAN
Year of Publication 24.02.2015
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Year of Publication 24.02.2015
Patent
Large scale System-in-Package (SiP) module for future networking products
Ohta, R., Nagar, M., Ahmad, M., Tamagawa, M., Miyata, K., Suzuki, T.
Published in 2012 2nd IEEE CPMT Symposium Japan (01.12.2012)
Published in 2012 2nd IEEE CPMT Symposium Japan (01.12.2012)
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Conference Proceeding